Galvanostatic electrodeposition and microstructure of copper (I) oxide film

TLDR: In this article, the effect of bath temperature, bath pH and current density on the compositon, grain size, surface texture and surface morphology of the electrodeposited polycrystalline copper (I) oxide films were investigated.

Abstract: Polycrystalline copper (I) oxide films were deposited on stainless steel substrate by galvanostatic electrodeposition method and were characterized by Xray diffraction and scanning electron microscopy. The effect of bath temperature, bath pH and current density on the compositon, grain size, surface texture and surface morphology of the electrodeposited films were investigated. The films deposited at low bath pH (less than or equal to 7) consisted of copper (I) oxide and metallic copper; while the films deposited at bath pH between 8 and 12 and bath temperature of 60 degrees C were pure copper (I) oxide. The preferred orientation of the copper (I) oxide films depended on the relative growth rate of (111) and (200) faces and could be controlled by adjusting the bath pH and/or the cathodic current density. (100)-oriented copper (1) oxide films could be deposited at pH=9 and current densities in the range of 0.25-1 mA/cm(2) while (111)-oriented films could be prepared at pH=12 or at pH=9 using the current densities between 1.5-2.5 mA/cm(2). Computer simulated crystallite shapes showed that the crystal shape changed from octahedral for (100)-oriented film to trucated pyramids and cubs for (111)-oriented film. And they were approved by scanning electron microscopy.