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MEMS Reliability Assurance Guidelines for Space Applications
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In this paper, a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability is provided, including material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS.Abstract:
This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment.read more
Citations
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Journal ArticleDOI
MEMS reliability from a failure mechanisms perspective
TL;DR: An overview of MEMS failure mechanisms that are commonly encountered is provided, focusing on the reliability issues of micro-scale devices, but, for some issues, the field of their macroscopic counterparts is also briefly touched.
Patent
Scanning depth engine
TL;DR: In this article, a transmitter and a scanner are coupled to generate an output indicative of a time of flight of the pulses to and from points in the scene, and a processor is coupled to control the scanner so as to cause the beam to scan over a selected window within the scan range and to process the output of the receiver so that to generate a 3D map of a part of the scene that is within the selected window.
Journal ArticleDOI
MEMS Reliability Review
TL;DR: The common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection are reviewed.
Journal ArticleDOI
Polymer integration for packaging of implantable sensors
TL;DR: In this paper, the authors give an overview of the use of polymers in implantable sensor packages, and identify future directions for their application, and assess the specific merits and drawbacks of several material-process combinations.
References
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Proceedings ArticleDOI
Advanced multichip module packaging of microelectromechanical systems
TL;DR: New methods of packaging MEMS using two advanced MCM foundry processes are described and a special purpose surface micromachined MEMS packaging test chip was designed and fabricated.
Proceedings ArticleDOI
Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates
TL;DR: In this paper, a fluxless flip chip mounting process by use of Au/Sn solder bumps on different thick film metallizations of green tape ceramic substrates is described. And the results of the investigations show that fluxless flipping chip bonding is possible directly on Au as well as Ag and Pd/Ag thick film pattern and via metallization.
Journal ArticleDOI
Space applications of micro/nano-technologies
TL;DR: The rationale, potential advantages, applications and problems to solve for the utilization of micro/nano-technologies in space-based systems are addressed in this article, where activities at the European Space Agency in this field are outlined and the current action plan is presented.
Proceedings ArticleDOI
Performance of non-planar silicon diaphragms under large deflections
Y. Zhang,Kensall D. Wise +1 more
TL;DR: In this paper, the fabrication and detailed simulation of corrugated-bossed structures that unfold, accordion-like, to produce high boss deflections are reported, and effects related to corrugation profile diaphragm size and thickness, and internal stress are explored.
Proceedings ArticleDOI
Material and processing issues for the monolithic integration of microelectronics with surface-micromachined polysilicon sensors and actuators
TL;DR: In this article, the issues of yield, repeatability, and uniformity of the tungsten/CMOS approach are addressed, and material issues related to the development of high-temperature diffusion barriers, adhesion layers, and low-stress films are discussed.