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MEMS Reliability Assurance Guidelines for Space Applications
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In this paper, a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability is provided, including material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS.Abstract:
This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment.read more
Citations
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Journal ArticleDOI
MEMS reliability from a failure mechanisms perspective
TL;DR: An overview of MEMS failure mechanisms that are commonly encountered is provided, focusing on the reliability issues of micro-scale devices, but, for some issues, the field of their macroscopic counterparts is also briefly touched.
Patent
Scanning depth engine
TL;DR: In this article, a transmitter and a scanner are coupled to generate an output indicative of a time of flight of the pulses to and from points in the scene, and a processor is coupled to control the scanner so as to cause the beam to scan over a selected window within the scan range and to process the output of the receiver so that to generate a 3D map of a part of the scene that is within the selected window.
Journal ArticleDOI
MEMS Reliability Review
TL;DR: The common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection are reviewed.
Journal ArticleDOI
Polymer integration for packaging of implantable sensors
TL;DR: In this paper, the authors give an overview of the use of polymers in implantable sensor packages, and identify future directions for their application, and assess the specific merits and drawbacks of several material-process combinations.
References
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