Proceedings ArticleDOI
Modeling of vapor chamber as heat spreading devices
Xiaojin Wei,Kamal K. Sikka +1 more
- pp 578-585
TLDR
In this paper, a thermal model has been developed consisting of a heated chip integrated with a substrate, thermal interface material, vapor chamber lid and heat sink, where the model can predict the temperature profile fairly well as compared with the results of a detailed numerical model.Abstract:
As the heat density on the chip increases and heat dissipation is more localized, there are growing interests in developing alternative heat spreading devices. Vapor chambers have been used as heat spreading devices in heat sink bases. Before considering for integration into package heat spreaders or lids, the compatibility of the vapor chamber with the assembly processes would have to be assessed. However, before embarking down that path, this paper attempts to quantify the thermal benefit, if any, of vapor chamber heat spreaders compared to commonly used solid metal heat spreaders. A thermal model has been developed consisting of a heated chip integrated with a substrate, thermal interface material, vapor chamber lid and heat sink. The vapor chamber is represented by multiple block layers with effective thermal conductivities. It is revealed that the model can predict the temperature profile fairly well as compared with the results of a detailed numerical model. A sensitivity study shows that the thermal performance is sensitive to the effective thermal conductivity of the wick structure and insensitive to the effective thermal conductivity of the vapor space. A parametric study indicates that the vapor chamber heat spreader out-performs a copper block of the same dimension when the footprint size is larger than a certain value. It is concluded that vapor chamber is most effective in spreading heat over large areas. Consequently, it is suitable for applications where more surface area is desired due to reasons such as low heat transfer coefficientsread more
Citations
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Journal ArticleDOI
Numerical analyses on optimizing a heat pipe thermal management system for lithium-ion batteries during fast charging
TL;DR: In this paper, an optimized heat pipe thermal management system (HPTMS) is proposed for fast charging lithium ion battery cell/pack, and a numerical model is developed and comprehensively validated with experimental results.
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Challenges in Cooling Design of CPU Packages for High-Performance Servers
TL;DR: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed and the development of a new metallic thermal interface technology is introduced.
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A Review of Vapor Chambers
TL;DR: In this paper, the authors proposed a cooling system to dissipate large amount of heat produced over a small area in electronic industry, which will require efficient cooling systems to enable the development in electronic industries.
Journal ArticleDOI
The performance of the novel vapor chamber based on the leaf vein system
TL;DR: In this article, a conceptual structure is designed to form the wick of a vapor chamber, in which the leaf-vein-like fractal network and the micro fin-pins are used to simulate the leaf vein network and mesophyll tissue respectively.
Journal ArticleDOI
Experimental investigation of a vapor chamber featuring wettability-patterned surfaces
TL;DR: In this article, surface-wettability patterning is used inside vapor chambers made of copper with and without wicking posts to improve condensation performance in the presence of metal wicks.
References
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Book
A Treatise on Electricity and Magnetism
TL;DR: The most influential nineteenth-century scientist for twentieth-century physics, James Clerk Maxwell (1831-1879) demonstrated that electricity, magnetism and light are all manifestations of the same phenomenon: the electromagnetic field as discussed by the authors.
Journal ArticleDOI
A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
Journal ArticleDOI
Spreading in the heat sink base: phase change systems or solid metals??
TL;DR: In this paper, two simple models are presented to address the heat transfer limitations in phase change systems, and the ratio of phase change spreading resistance over solid metal spreading can be estimated, using these models, the authors determine the envelope of the limitations for phase change heat spreaders used in processor cooling, and to compare their performance against high thermal conductivity solid metals.