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Ohmic contacts to n-type germanium with low specific contact resistivity

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TLDR
A low temperature nickel process has been developed that produces Ohmic contacts to n-type germanium with specific contact resistivities down to (23 −± 18) −7 Ω-cm2 for anneal temperatures of 340 −°C.
Abstract
A low temperature nickel process has been developed that produces Ohmic contacts to n-type germanium with specific contact resistivities down to (23 ± 18) × 10−7 Ω-cm2 for anneal temperatures of 340 °C The low contact resistivity is attributed to the low resistivity NiGe phase which was identified using electron diffraction in a transmission electron microscope Electrical results indicate that the linear Ohmic behaviour of the contact is attributed to quantum mechanical tunnelling through the Schottky barrier formed between the NiGe alloy and the heavily doped n-Ge

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Journal ArticleDOI

The thermoelectric properties of Ge/SiGe modulation doped superlattices

TL;DR: In this article, the thermoelectric and physical properties of superlattices consisting of modulation doped Ge quantum wells inside Si 1−yGey barriers are presented.
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Reduction in Specific Contact Resistivity to $ \hbox{n}^{+}$ Ge Using $\hbox{TiO}_{2}$ Interfacial Layer

TL;DR: In this paper, a metal-insulator-semiconductor (MIS) contact using a TiO2 interfacial layer on highly doped n+Ge to overcome the problem of metal-Fermi-level pinning on Ge, which results in a large electron barrier height.
Journal ArticleDOI

The cross-plane thermoelectric properties of p-Ge/Si0.5Ge0.5 superlattices

TL;DR: The electrical conductivity, Seebeck coefficients, and thermal conductivities of a range of p-type Ge/Si 0.5 superlattices designed for thermoelectric generation and grown by low energy plasma enhanced chemical vapor deposition have been measured using a series of microfabricated test structures.
Journal ArticleDOI

The ${\sim } 3\,{\times } 10^{20}$ cm $^{-3}$ Electron Concentration and Low Specific Contact Resistivity of Phosphorus-Doped Ge on Si by In-Situ Chemical Vapor Deposition Doping and Laser Annealing

TL;DR: In this article, the authors showed that due to 4% misfit between Ge and Si, there are still misfit dislocations near the Ge/Si interface, which leads to the ideality factor of 1.6 for the ge/Si hetero-junction diode with ON/OFF ratio of 1\times 10^{5}$.
References
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Book

Binary alloy phase diagrams

TL;DR: Binary Alloy Phase Diagrams, Second Edition, Plus Updates, on CD-ROM offers you the same high-quality, reliable data you'll find in the 3-volume print set published by ASM in 1990.
Journal ArticleDOI

Fermi-level pinning and charge neutrality level in germanium

TL;DR: The Schottky barrier height in metal/Ge contacts shows weak dependence on the metal work function indicating strong Fermi-level pinning close to the Bardeen limit.
Journal ArticleDOI

Academic and industry research progress in germanium nanodevices

Ravi Pillarisetty
- 17 Nov 2011 - 
TL;DR: Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.
Journal ArticleDOI

Evidence for strong Fermi-level pinning due to metal-induced gap states at metal/germanium interface

TL;DR: In this article, Ohmic and Schottky properties of metal/germanium (Ge) junction have been investigated and it has been shown that Fermi level at metal/Ge interface is intrinsically pinned at the charge neutrality level (CNL) characterized by the metal-induced gap states model.
Journal ArticleDOI

Thin film reaction of transition metals with germanium

TL;DR: In this paper, the thermally induced reaction of 20 transition metals (Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, and Cu) with Ge substrates was carried out in order to identify appropriate contact materials in Ge-based microelectronic circuits.
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