Journal ArticleDOI
Process research of high aspect ratio microstructure using SU-8 resist
TLDR
In this article, the interaction between the exposure dose and post exposure bake has played an important role in adhesion between SU-8 resist and the substrate and the proposed process conditions are given.Abstract:
SU-8 is a negative, epoxy type, near-UV photoresist. This resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications using standard lithography equipment. However, in practice, SU-8 has shown to be very sensitive to process parameter variation. The orthogonal array was used in our experiments in order to improve the lithography quality and analyze the interaction among the parameters. The analyses show that the interaction between the exposure dose and post exposure bake has played an important role in adhesion between SU-8 resist and the substrate. The proposed process conditions are given. The output structure has straight sidewall profile, fine line and good space resolution. The aspect ratio is larger than 20. Moreover, several metallic films are used as substrates. The Ti film with oxidation treatment was found to have the strongest adhesion to the resist. The result will help to open possibilities for low-cost LIGA-type process for MEMS applications.read more
Citations
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Journal ArticleDOI
SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography
A. del Campo,Christian Greiner +1 more
TL;DR: The SU-8 photoresist has become the favourite photoreist for high-aspect-ratio (HAR) and three-dimensional (3D) lithographic patterning due to its excellent coating, planarization and processing properties as well as its mechanical and chemical stability as mentioned in this paper.
Journal ArticleDOI
Fabrication and performance of MEMS-based piezoelectric power generator for vibration energy harvesting
TL;DR: The investigation shows that the designed MEMS-based energy harvesting device is expected to resonantly operate in low-frequency environmental vibration through tailoring the structure dimension.
Journal ArticleDOI
Femtosecond laser microstructuring for polymeric lab‐on‐chips
Shane M. Eaton,Carmela De Marco,R. Martinez-Vazquez,Roberta Ramponi,Stefano Turri,Giulio Cerullo,Roberto Osellame +6 more
TL;DR: Femtosecond laser microfabrication technology opens the door to fabricating integrated lab-on-chip devices with a single tool, offering unmatched versatility in fabricating surface microchannels and diffractive optics by means of laser ablation.
Journal ArticleDOI
A Planar One-Port Microwave Microfluidic Sensor for Microliter Liquids Characterization
Xiue Bao,Ilja Ocket,Giovanni Crupi,Dominique Schreurs,Juncheng Bao,Dries Kil,Bob Puers,Bart Nauwelaers +7 more
TL;DR: In this paper, the authors describe the design, fabrication, and assessment of an on-wafer measurement platform for noninvasive quantitative characterization of small volumes of liquids over the frequency range from 500 kHz to 1 GHz.
Journal ArticleDOI
Broadband Dielectric Spectroscopy of Cell Cultures
Xiue Bao,Ilja Ocket,Juncheng Bao,Jordi Doijen,Ju Zheng,Dries Kil,Zhuangzhuang Liu,Bob Puers,Dominique Schreurs,Bart Nauwelaers +9 more
TL;DR: In this article, the authors presented a platform that combines a miniaturized coplanar waveguide (CPW) transmission line (TL) sensor and a special CPW-fed interdigitated capacitor (IDC), which allows them to measure the complex permittivity of cell cultures from 300 kHz to 50 GHz.
References
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Journal ArticleDOI
SU-8: a low-cost negative resist for MEMS
TL;DR: In this paper, the characterization of a home-made negative photoresist developed by IBM is described, called SU-8, which can be produced with commercially available materials and has an outstanding aspect ratio near 15 for lines and 10 for trenches, combined with the electroplating of copper allow the fabrication of highly integrated electromagnetic coils.
Journal ArticleDOI
Negative photoresists for optical lithography
TL;DR: The history and chemistry of negative-resist systems and their development in IBM are provided and materials with wide processing latitude and high resolution are provided that are used to manufacture IBM's advanced CMOS devices and to achieve high-aspect-ratio patterns for micromachining applications.
Journal ArticleDOI
Mechanical characterization of a new high-aspect-ratio near UV-photoresist
TL;DR: In this article, the mechanical and thermal properties of the SU-8 resist have been analyzed using a single spin process with a UV aligner, which produces outstanding aspect ratios, 15 for lines and trenches.
Proceedings ArticleDOI
Simple and low cost fabrication of embedded micro-channels by using a new thick-film photoplastic
TL;DR: In this article, the SU-8 photoresist has outstanding properties, allowing the realisation of high aspect ratio microstructures, which can be used for the realization of thermal flow-sensors.
Proceedings ArticleDOI
High-aspect-ratio, ultrathick, negative-tone near-uv photoresist for MEMS applications
TL;DR: The IBM SU-8 resist material as mentioned in this paper is an epoxy-based resist designed specifically for ultrathick, high-aspect-ratio MEMS-type applications and it has been shown that with single-layer coatings, thicknesses of more than 500 /spl mu/m can be achieved reproducibly.
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SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography
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