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Journal ArticleDOI

Study of the damage produced in 6H-SiC by He irradiation

TLDR
In this paper, the authors investigated the lattice damage and evolution in 6H-SiC wafers under He + ion irradiation by the combination of Rutherford backscattering in channeling geometry (RBS/C), Raman spectroscopy, UV visible spectrograms and transmission electron microscopy (TEM).
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This article is published in Vacuum.The article was published on 2011-11-11. It has received 33 citations till now. The article focuses on the topics: Raman spectroscopy & Annealing (metallurgy).

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Citations
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Journal ArticleDOI

The structural evolution of light-ion implanted 6H-SiC single crystal: Comparison of the effect of helium and hydrogen

TL;DR: The microstructure evolution of hydrogen-implanted 6H-SiC at different temperatures and fluences is investigated by using various experimental techniques in this article, where the authors found that both migration and coalescence are energetically cheaper in the case of H compared to He.
Journal ArticleDOI

Transmission electron microscopy investigations of bubble formation in He-implanted polycrystalline SiC

TL;DR: The formation of He bubbles observed in the hot-pressed polycrystalline SiC samples implanted with 230-keV He ions with fluences ranging from 5-10 15/cm 2 to 1-×-10 17 /cm 2 at room temperature and subsequently annealed at 1000-°C for 30min was investigated in this article.
Journal ArticleDOI

He-vacancy interaction and multiple He trapping in small void of silicon carbide

TL;DR: In this paper, the authors explored the microscopic mechanism of He trapping in vacancies and voids, and explored He-vacancy interactions in He n Va m (Va for vacancy) clusters (n, m, = 1-4) and multiple He traps in a 7-atom void of silicon carbide (SiC).
Journal ArticleDOI

Irradiation-induced microstructure damage in He-irradiated 3C-SiC at 1000℃

TL;DR: In this article, the effect of high-temperature helium irradiation on microstructural evolution of 3C-SiC wafers was investigated by the combination of Raman spectroscopy, conventional transmission electron microscopy (TEM) and high resolution transmission electron microscope (HRTEM).
Journal ArticleDOI

Efficient ion-slicing of InP thin film for Si-based hetero-integration.

TL;DR: A kinetics analysis of the thermally activated blistering process suggests that the sequential implantation of He and H ions can reduce the InP thin film splitting thermal budget dramatically.
References
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Book

The stopping and range of ions in solids

TL;DR: A review of existing widely-cited tables of ion stopping and ranges can be found in this paper, where a brief exposition of what can be determined by modern calculations is given.
Book

Optical Processes in Semiconductors

TL;DR: Optical processes in semiconductors as mentioned in this paper, Optical Process in Semiconductors (OPP), Optical Process of Semiconductor (OPS) and Optical Process (OPI)
Journal ArticleDOI

Raman Investigation of SiC Polytypes

TL;DR: In this article, the plasmon LO-phonon coupled modes whose spectral profiles are used to evaluate the carrier concentration and mobility of SiC crystals are discussed, and anisotropic electronic properties of α-SiC and characteristics of heavily doped crystals are also treated.
Journal ArticleDOI

Progress in silicon carbide semiconductor electronics technology

TL;DR: In this article, the authors present the present status of SiC-based semiconductor electronics and identify areas where technological maturation is needed and the prospects for resolving these obstacles are discussed.
Journal ArticleDOI

Silicon carbide: Synthesis and processing

TL;DR: In this paper, the authors summarized some aspects of crystal growth and processing and discussed arising problems in the process of crystallizing silicon carbide, a material of choice for special optoelectronic and electronic devices working under extreme conditions.
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