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Proceedings ArticleDOI

Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure

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TLDR
In this article, a novel approach for the suppression of the parallel-plate noise in high-speed circuits is proposed by utilizing a metallic electromagnetic band-gap (EBG) structure.
Abstract: 
A novel approach for the suppression of the parallel-plate noise in high-speed circuits is proposed by utilizing a metallic electromagnetic band-gap (EBG) structure. The key idea relies on replacing one of the two solid electric conductor plates with a metallic EBG surface of compact texture. To validate the concept, an EBG surface was fabricated and employed in a number of via-containing parallel-plate test boards. Frequency domain measurements showed a band-gap of about 1.7 GHz around 3.77 GHz. More importantly, suppression of the parallel-plate noise by 65% was achieved based on time domain reflectometry experiments.

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Citations
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Journal ArticleDOI

Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits

TL;DR: In this paper, a novel approach for the suppression of the parallel-plate waveguide (PPW) noise in high-speed printed circuit boards is presented, where one of the two conductors forming the PPW is replaced by an electromagnetic bandgap (EBG) surface.
Patent

Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards

TL;DR: In this article, a lower conductive plate (3422) at a distance tl from the array of conductive coplanar patches and conductive rods (3126) extending from respective patches to the lower plate was used to suppress noise and electromagnetic coupling.
Journal ArticleDOI

Electromagnetic-bandgap layers for broad-band suppression of TEM modes in power planes

TL;DR: In this article, a practical set of engineering design equations are derived for predicting stopband performance of electromagnetic-bandgap (EBG) structures within parallel power planes, which suppress the TEM-mode noise within parallel plates used within digital power distribution networks.
Journal ArticleDOI

Design and modeling of high-impedance electromagnetic surfaces for switching noise suppression in power planes

TL;DR: In this paper, a detailed design and modeling approach for power planes with integrated high-impedance electromagnetic surfaces (HIS) is presented, which have the unique ability of providing effective broadband simultaneous switching noise mitigation.
Journal ArticleDOI

Analysis and Modeling of Hybrid Planar-Type Electromagnetic-Bandgap Structures and Feasibility Study on Power Distribution Network Applications

TL;DR: In this paper, a unified 1D analysis model of hybrid planar-type electromagnetic-bandgap (EBG) structures is developed, and three types of hybrid design methods to reduce the cutoff frequency of the EBG structures are discussed, and design equations for their noise suppression bandwidths are derived.
References
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Journal ArticleDOI

High-impedance electromagnetic surfaces with a forbidden frequency band

TL;DR: In this paper, a new type of metallic structure has been developed that is characterized by having high surface impedance, which is analogous to a corrugated metal surface in which the corrugations have been folded up into lumped-circuit elements and distributed in a two-dimensional lattice.
Journal ArticleDOI

High-frequency characterization of power/ground-plane structures

TL;DR: In this article, the authors describe a strategy to characterize power and groundplane structures using a full cavity-mode frequency-domain resonator model, and introduce a novel technique to suppress modal impedances, minimizing both transfer and input impedances.
Book

EMC and the printed circuit board : design, theory, and layout made simple

TL;DR: This accessible, new reference work shows how and why RF energy is created within a printed circuit board and themanner in which propagation occurs and shows the relationship between time and frequencydomains to help you meet mandatory compliance requirements placed on printed circuit boards.
Journal ArticleDOI

Physics-based CAD models for the analysis of vias in parallel-plate environments

TL;DR: In this paper, physics-based computer-aided-design (CAD) models for through and buried vias in parallel-plate environments are presented based on radial transmission-line theory.
Proceedings ArticleDOI

Leakage suppression in stripline circuits using a 2-D photonic bandgap lattice

TL;DR: In this paper, a novel method for suppressing leakage due to parallel plate mode in stripline circuits using a uni-planar compact 2-D PBG lattice is proposed and demonstrated.
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