Journal ArticleDOI
A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
TLDR
In this paper, a novel technique for suppressing power plane resonance at microwave and radio frequencies is presented, which consists of replacing one of the plates of a parallel power plane pair with a high impedance surface or electromagnetic band gap structure.Abstract:
A novel technique for suppressing power plane resonance at microwave and radio frequencies is presented. The new concept consists of replacing one of the plates of a parallel power plane pair with a high impedance surface or electromagnetic band gap structure. The combination of this technique with a wall of RC pairs extends the lower edge of the effective bandwidth to dc, and allows resonant mode suppression up to the upper edge of the band-gap. The frequency range for noise mitigation is controlled by the geometry of the HIGP structure.read more
Citations
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Journal ArticleDOI
Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures
S. Shahparnia,Omar M. Ramahi +1 more
TL;DR: In this paper, an effective method for suppressing PCB radiation from their power bus over an ultrawide range of frequencies by using metallo-dielectric electromagnetic band-gap structures was introduced.
Journal ArticleDOI
Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits
TL;DR: In this article, a power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic bandgap (LPC-EBG) structure.
Journal ArticleDOI
Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation
TL;DR: In this article, the authors reviewed possible solutions based on decoupling or isolation for suppressing power distribution network (PDN) noise on package or printed circuit board (PCB) levels.
Journal ArticleDOI
A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits
TL;DR: In this article, a novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz.
Patent
Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards
TL;DR: In this article, a lower conductive plate (3422) at a distance tl from the array of conductive coplanar patches and conductive rods (3126) extending from respective patches to the lower plate was used to suppress noise and electromagnetic coupling.
References
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Journal ArticleDOI
High-impedance electromagnetic surfaces with a forbidden frequency band
TL;DR: In this paper, a new type of metallic structure has been developed that is characterized by having high surface impedance, which is analogous to a corrugated metal surface in which the corrugations have been folded up into lumped-circuit elements and distributed in a two-dimensional lattice.
Journal ArticleDOI
Study of the ground bounce caused by power plane resonances
TL;DR: In this article, the effect of power plane resonances on the ground bounce of the system by performing finite-difference time-domain (FDTD) simulations is investigated. And two methods to prevent this ground bounce effect are investigated.
Journal ArticleDOI
Analysis of power/ground-plane EMI decoupling performance using the partial-element equivalent circuit technique
TL;DR: In this paper, the partial element equivalent circuit (PEEC) was used to predict the performance of various decoupling design strategies for printed circuit (PC) boards with decoupled capacitors.
Proceedings ArticleDOI
Investigation of power/ground plane resonance reduction using lumped RC elements
TL;DR: In this paper, a study of reducing package resonance between power and ground planes with discrete RC components is presented, where the RC components function to disrupt some of these standing waves and flatten the resonant impedance spikes by providing a "matched load" to the power and round plane impedance while maintaining DC isolation between the planes.