Proceedings ArticleDOI
Trends of Power Electronic Packaging and Modeling
Yong Liu,S. Irving,Timwah Luk,D. Kinzer +3 more
- pp 1-11
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TLDR
In this article, a review of recent advances in power electronic packaging is presented based on the development of power device integration, and the role of modeling is key to assure successful package design.Abstract:
A review of recent advances in power electronic packaging is presented based on the development of power device integration. The presentation will cover in more detail how advances in both semiconductor content and power advanced package design and materials have co-enabled significant advances in power device capability during recent years. Extrapolating the same trends in representative areas for the remainder of the decade serves to highlight where further improvement in materials and techniques can drive continued enhancements in usability, efficiency, reliability and overall cost of power semiconductor solutions. Along with new power packaging development, the role of modeling is key to assure successful package design. An overview of the power package modeling is presented. Challenges of power semiconductor packaging and modeling in both next generation design and assembly processes are presented and discussed.read more
Citations
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Journal ArticleDOI
Lifetime modelling for microsystems integration: from nano to systems
Bernhard Wunderle,Bruno Michel +1 more
TL;DR: In this article, the authors deal with the thermo-mechanical reliability of microelectronic components and systems and methods to analyse and predict it, the latter promoting the field of nano-reliability for future packaging challenges in advanced electronics system integration.
Journal ArticleDOI
Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Bernhard Wunderle,K.-F. Becker,R. Sinning,O. Wittler,R. Schacht,Hans Walter,Martin Schneider-Ramelow,K. Halser,N. Simper,Bruno Michel,H. Reichl +10 more
TL;DR: In this paper, the authors examined the thermo-mechanical reliability of polymer-encapsulated chip-on-board (COB) assemblies for power applications by simulation and experiment.
Journal ArticleDOI
Trends of power semiconductor wafer level packaging
TL;DR: The paper covers in more detail how advances in both semiconductor content and power advanced wafer level package design and materials have co-enabled significant advances in power device capability during recent years.
Reliability Analysis of Low Temperature Low Pressure Ag-Sinter Die Attach
TL;DR: In this paper, the thermo-mechanical reliability of chip-on-board (COB) assemblies for power applications is studied by experiment and simulation and the main focus is set on the characterization methods and low cycle fatigue failure behavior of the die-attach material under thermal cycling conditions.
Proceedings ArticleDOI
Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation
Bernhard Wunderle,M. Klein,Lothar Dietrich,M. Abo Ras,R. Mrossko,D. May,R. Schacht,Hermann Oppermann,Bruno Michel,Herbert Reichl +9 more
TL;DR: In this article, the authors have developed both bulk and interface technologies to reduce thermal resistance using Ag and Au-based materials and low-T and lowp processes to render them eligible for the electronics industry.
References
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Power Electronics and Motor Drives in Electric, Hybrid Electric, and Plug-In Hybrid Electric Vehicles
TL;DR: A brief review of the current trends and future vehicle strategies and the function of power electronic subsystems are described and the requirements of power electronics components and electric motor drives for the successful development of these vehicles are presented.
Journal ArticleDOI
Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions
Journal ArticleDOI
Power Semiconductor Devices for Hybrid, Electric, and Fuel Cell Vehicles
Z.J. Shen,I. Omura +1 more
TL;DR: The system requirement and latest development of power semiconductor devices including IGBTs, freewheeling diodes, and advanced power module technology in relating to electric vehicle applications are reviewed.
Journal ArticleDOI
Thermosonic wire bonding process simulation and bond pad over active stress analysis
Yong Liu,S. Irving,Timwah Luk +2 more
TL;DR: In this paper, a transient non-linear dynamic finite element framework is developed, which integrates the wire bonding process and the silicon devices under the bond pad to model the impact strain hardening effect.
Journal ArticleDOI
3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package
TL;DR: The three dimensional electromigration finite element model for IC device/interconnects and solder joint reliability are developed and tested, and a refined mesh sub-model is constructed to reduce the computational costs and to improve the calculation accuracy.