Journal ArticleDOI
Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrate
Ervina Efzan Mhd Noor,Nurulakmal Mohd Sharif,Cheong Kuan Yew,Tadashi Ariga,Ahmad Badri Ismail,Zuhailawati Hussain +5 more
TLDR
In this article, the surface and interfacial properties of a proposed lead-free solder material, the In-31.6Bi-19.6Sn system, were studied on a copper substrate at different reflow temperatures.About:
This article is published in Journal of Alloys and Compounds.The article was published on 2010-09-24. It has received 57 citations till now. The article focuses on the topics: Contact angle & Sessile drop technique.read more
Citations
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Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder
TL;DR: The influence of In element on microstructure and properties of Sn-Bi based lead-free solder was investigated in this paper. But, it was not shown that the In element increased the tensile strength of the Sn matrix and increased the reaction temperature.
Journal ArticleDOI
Direct writing of electronics based on alloy and metal (DREAM) ink: A newly emerging area and its impact on energy, environment and health sciences
TL;DR: In this article, a fundamentally different strategy was recently proposed by the authors' lab towards truly direct writing of electronics through introduction of a new class of conductive inks made of low melting point liquid metal or its alloy.
Journal ArticleDOI
Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties
TL;DR: In this article, Ni particle-reinforced composite solders were prepared by mechanically dispersing Ni particles into Sn-8Zn-3Bi alloy and the bulk properties of the composite solder alloy were characterized metallographically, thermally and mechanically.
Journal ArticleDOI
Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution
TL;DR: In this paper, a method for preparing metallic Cu nanoparticles in aqueous solution is proposed, and metal-metal bonding with the use of the nanoparticles is demonstrated, and a stage and a plate of metallic Cu were successfully bonded under annealing at 400°C and pressurizing at 1.2MPa for 5min in H 2 gas with the help of the metallic Cu particles.
Journal ArticleDOI
Low melting point solders based on Sn, Bi, and In elements
TL;DR: In this paper, a review of low melting point solders with a melting point lower than 180°C and even below 100°C is presented, with trace addition of a third element to them.
References
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Book
Alloy phase diagrams
TL;DR: In this article, an introductory source aimed at practicing engineers and material scientists, the text explains how to use phase diagrams, and more than 1,000 binary and 300 ternary diagrams included cover most commercial alloy systems; compositions are presented in weight percent.
Journal ArticleDOI
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Kejun Zeng,King-Ning Tu +1 more
TL;DR: In this paper, the authors used the format of case study to review six reliability problems of Pb-free solders in electronic packaging technology and conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes.
Book
The Mechanics of solder alloy interconnects
TL;DR: In this paper, the mechanics of soldere alloy interconnects are discussed, and the mechanical properties of solder joints are predicted and accelerated testing is carried out for through-hole surface mount solder joints under thermal, mechanical and vibration conditions.
Journal ArticleDOI
Characterization of eutectic Sn-Bi solder joints
Z. Mei,J. W. Morris +1 more
TL;DR: In this paper, experimental results on 58Bi-42Sn solder joints, optical and SEM microstructures of their matrix and of their interface with copper, solidification behavior studied by differential scanning calorimetry, wettability to copper, creep, and low cycle fatigue.
Book
Principles of Soldering
Giles Humpston,David M. Jacobson +1 more
TL;DR: The Principles of Soldering and Brazing as discussed by the authors is a comprehensive overview of soldering and its application in the field of software engineering, focusing on the fundamental principles that underlie this field of technology rather than recipes for making joints.