Showing papers on "Electroless nickel plating published in 2020"

General Strategy for Preparation of Porous Nickel Phosphide Nanosheets on Arbitrary Substrates toward Efficient Hydrogen Generation

Abstract: Nickel phosphides have been widely explored for electrocatalytic hydrogen evolution reaction (HER) due to their high activity and durability. To date, however, it is still a big challenge to develop facile and scalable approaches to preparing nickel phosphide structures with high HER performance for practical applications. Here, a general strategy is demonstrated for facile preparation of porous nickel phosphide nanosheets on arbitrary substrates by electroless Ni plating on the substrate followed by a convenient and stable phosphidation reaction. Typical porous nickel phosphide nanosheets (Ni5P4/NiP2/Ni2P) supported on carbon cloth show excellent electrocatalytic HER activities in acidic electrolyte with very small overpotentials of 63 mV and 120 mV to attain current densities of 10 mA cm–2 and 100 mA cm–2, respectively, and a very low Tafel slope of 47.3 mV dec–1, which are among the best results compared to other non-noble HER electrocatalysts. Furthermore, the electrode exhibits superior flexibility a...

An Erosion-Corrosion Investigation of Coated Steel for Applications in the Oil and Gas Field, Based on Bipolar Electrochemistry

Abstract: In this research, a simple experimental apparatus based on a bipolar electrode (BPE) configuration was set up, in order to tackle erosion-corrosion problems of materials of interest in the oil and gas field. As a case study, the resistance to erosion and corrosion of carbon steel samples coated by Electroless Nickel Plating and by thermo-sprayed coating with the high velocity oxy fuel (HVOF) process was investigated. The main objective was to demonstrate if this simple, contactless technique could be applied to effectively discriminate the erosion-corrosion behavior of different materials in a vast range of experimental conditions. In fact, by means of polarization curves, visual inspection and morphological analysis by scanning electron microscope (SEM), the effects due to erosion-corrosion by solid particles, by fluid and those due to simple erosion were evaluated.

A facile process combined with defect-induced electroless plating and selective laser sintering forming to fabricate catalytically active free-standing material

Abstract: The most common method for preparation of catalytically active free-standing hybrid material (CAFH) is that supporting material is formed and subsequent catalytic agent deposited on its surface. But it remains challenging to agilely prepare CAFH with different shape and size. We employ a facile process combined with defect-induced electroless nickel plating and selective laser sintering (SLS) forming to fabricate CAFH. Results manifested CH3COOH-etched treatment resulted in the formation of defect (amorphous structure, amide group and hole) on the Nylon 12 (PA12) surface, which would induce electroless Ni plating. The mechanism of the electroless plating is the destruction of the structure of [C6H5O73−-Ni] ligand around defect; subsequently, the reduction of the REDOX barrier. The following laser sintering of the plated PA12 powder could fabricate CAFH with an irregular network. There are two stages during the SLS process: balling of particle and formation of sintered neck. The combination of the structural stability, high surface area and recyclability gives a CAFH with demonstrated catalytic property. CAFH is agile to prepare, easy for quick-to-assemble material and realizable in CAFH shape design. The new technology possesses vast exploration and application value.

Properties and microstructure of nickel/graphite composites fabricated by electroless nickel plating and spark plasma sintering

Abstract: Electroless plating was adopted to produce Ni-P-coated graphite powder which was subsequently used to prepare nickel/graphite composites via spark plasma sintering (SPS). Effects of sinteri...

Physicochemical Model of Selection of Complex Compounds for Electroless Metal Plating

Abstract: A physicochemical model of the choice of a ligand for the electroless deposition of metal–phosphorus alloys is proposed based on determining the conditions for electrochemical reactions that cause the formation of the alloy and minimizing possible side reactions that impede the quality of the deposition process. Based on the physicochemical model, the optimal range of values of the stability constants and pH was determined for electroless nickel plating. It is shown that, for the pH range 7–9, which corresponds to the maximum deposition rates, stability constants take values from 5 to 10; carrying out the process in more alkaline solutions requires the use of more stable complexes. The predictive ability of the model is confirmed by experimental studies of the process of electroless nickel plating from solutions of various ligand compositions.

Development of micro-scale high aspect ratio patterned features with electroless nickel plating

Abstract: DEVELOPMENT OF MICRO-SCALE HIGH ASPECT RATIO PATTERNED FEATURES WITH ELECTROLESS NICKEL PLATING This thesis describes a novel method designed to pattern high aspect ratio metallic microscale features using a modified photolithography and electroless nickel plating process. This method utilizes modified photolithography techniques to create a polymer mold that is used to control the location of metal deposition on substrate during electroless nickel plating. In order to generate high aspect ratio mold features, a multiple spin-step process was developed to deposit thick layers of SU-8 photoresist, and inclined lithography was also used to generate tapered sidewalls that could help aid mold removal after plating. Results from electroplating experiments were evaluated using a Zygo interferometer and cast PDMS mold cross-sections to determine plating thickness and uniformity.

tert -Butylamine borane as a reductant in electroless nickel plating for improved etch resistance in the electrolyte

Abstract: An Ni–B coating was developed on a copper substrate by the direct electroless technique and from a plating bath containing tert-butylamine borane (TBAB). The influence of the electroless plating conditions, using TBAB as a reducing agent on the composition, surface morphology, high-temperature stability and etch resistance in the electrolyte of the coatings, was investigated. The resulting electroless Ni–B plating surfaces were examined and characterized by scanning electron microscopy and X-ray fluorescence spectroscopy for morphology and chemical composition, respectively. Electrochemical characterization by potentiodynamic polarization confirmed that a 0.1 M nickel concentration bath for the Ni–B plating was optimized by a TBAB concentration of 0.03 M, temperature of 60°C and pH of 8. Under the optimal bath conditions, the Ni–B electroless plating layer exhibited superior etch resistance in the electrolyte as well as improved stability at high temperature than the Ni–B electroless plating layer prepared using dimethylamine borane. Hence, owing to the remarkable properties of the Ni–B electroless plating layer, this fabrication technique that employs TBAB can be extended to fabricate other Ni–B electroless plating layers.

A Method for Electroless Nickel Plating on Aluminum Alloy Surface

Abstract: According to the following plating processes: deoiling → washing → pickling → washing → drying → weighing → electroless plating → washing → drying → weighing. It can obtain Ni-P deposit on aluminum alloy. It studied the influence of bath composition and process parameters on the composition and deposition rate of the alloy coating. Under temperature of 85~90°C, nickel sulfate hexahydrate 15~35g/L, sodium hypophosphite 10~30g/L, sodium citrate 5~10g/L, tartaric acid 1~2g/L, pH 3~5, reaction time 30~60min, load factor 1.0~2.0dm2/L. The microstructure, surface morphology, composition and valence of the elements in the alloy coating were studied by metallographic microscope, SEM, EDS and other modern analytical methods. The size of spherical grain was below 1um and compact distribution. The chemical coatings were mainly composed two elements, which were phosphorous and nickel. The mass percentage of phosphorous was about 15%, and the other one was about 80~85%. The corrosion resistance of the alloy coating was studied by CASS [1] test method, through 80h CASS test detection, the protection class of chemical coating can be reached 5. The relevant evaluation criteria can be referred to GB/T 6461-2002 [2]. The results show that the Ni-P binary amorphous alloy can be successfully prepared by this process.

Deposition of High-Density Carbon Nanotube-Containing Nickel-Based Composite Films by Low-Pressure Cold Spray

Abstract: Carbon nanotubes (CNTs) have a large specific surface area and, thus, are expected to have applications as electrodes, e.g., in fuel cells. A CNT-containing composite metal film with high electrode performance could be realized by implementing a large number of CNTs on the film. However, a composite film with a high density of CNTs has not yet been obtained. In the thermal spray field, including cold spray, metal–CNT composite films with more than 20 wt% of carbon nanotubes has not yet been deposited. In this study, high-density CNT-containing metal-based composite films were deposited onto an aluminum substrate by low-pressure cold spray from electroless nickel-plated CNT particles. The electroless nickel plating process caused slight structural damage to the CNTs, whereas the cold spray process did not cause any significant structural damage to the CNTs. Two phases were observed in the films: a CNT-rich layer and a nickel-rich layer. However, the CNTs maintained sufficient adhesive strength to remain attached to the bottom nickel phase. Composite films with at least 65 wt% CNT were produced with our method.

Semiconductor wafer and method for producing same

Abstract: Each embodiment of the present invention provides a semiconductor wafer which is suppressed in voids that are produced in the interface between a passivation film and an electroless nickel plating film, and which is configured such that an electrode pad is entirely covered by the electroless nickel plating film. A semiconductor wafer according to one embodiment of the present invention comprises,on a substrate, an electrode pad (12) and a passivation film (11) that covers the upper surface of the substrate and has an opening from which the electrode pad is exposed. This semiconductor wafer sequentially comprises, on the electrode pad (12), an electroless nickel plating film (13), an electroless palladium plating film (14) and an electroless gold plating film (15) in this order. A void, which is present in the interface between the passivation film (11) and the electroless nickel plating film (13), has a length (x) from the forefront of the void to the surface of the electrode pad of 0.3 [mu]m or more and a width (y) of 0.2 [mu]m or less; and the electrode pad (12) is entirely covered by the electroless nickel plating film (13).

Composition and Function Analysis of Electroless Nickel Plating Solution Based on Intelligent Network

Abstract: Although advanced electroless nickel plating coating treatment technology can significantly improve the chemical surface hardness and corrosion resistance of nickel and magnesium alloys, it is prone to corrosion in the electroless plating bath of nickel and magnesium and directly affects the corrosion performance of electroless nickel plating coating. The purpose of this paper is to analyze the composition of electroless nickel plating solution and its stability in electroless nickel plating solution by combining with intelligent network algorithm, so as to obtain a formula of electroless nickel plating solution of magnesium alloy with high chemical stability and strong buffering capacity. This article mainly through scanning electron energy dispersive X-ray spectroscopy, X-ray diffractometer and electrochemical testing and other modern chemical detection equipment and technologies for magnesium alloy chemical nickel plating layer of the macroscopic surface morphology, microstructure, deposition rate, deposition potential, deposition current various chemical parameters such as the dynamic characterization and electrochemical testing, the initial process of the magnesium alloy electroless nickel plating is studied, pretreatment process, dynamic equation and the electrochemical properties of plating solution, through the intelligent network processing data, the results can be found that the concentration of sulfuric acid >12 \( {\text{g}} \cdot {\text{dm}}^{ - 3} \) can increase the deposition rate.

An electroless nickel plating solution easy to convert use

Abstract: One aspect of the present invention provides an electroless nickel plating solution composition, including: a nickel compound; a hypophosphorous acid compound; a metal salt including one ion selected from a group consisting of copper, manganese, molybdenum, zinc, magnesium, cadmium, thorium, selenium, tellurium, arsenic, bismuth, lead, tin, titanium, aluminum, gallium, indium, thallium and combinations of two or more of the same; a sulfur compound; a cobalt compound; and water The present invention can improve productivity

Enhanced nickel plating process

Abstract: A method for plating nickel onto a glass surface of a substrate by sequentially contacting the surface with a solution having an oxidizing agent, a solution containing a silane compound, a Pd/Sn solution, and a nickel ion-containing solution, thereby accomplishing an electroless nickel plating process.

Manufacturing Method of Highly Purified Nickel Sulfate from the raw materials of Nickel Cobalt and Manganese Mixed Sulfide Precipitation

Abstract: The present invention relates to a method of manufacturing nickel sulfate used for a secondary battery positive electrode material, industrial electrolytic nickel plating, electroless nickel plating, and the like. More particularly, the present invention relates to a method for manufacturing high purity nickel sulfate, which can: extract 97% or more of nickel components from a nickel, cobalt and manganese-mixed sulfide raw material containing calcium under a continuous process including a recycling process; minimize the use of an organic solvent and discharge of wastewater; additionally recover cobalt, zinc, manganese components, etc. as by-products; and produce high-purity sodium sulfate.

Method for forming nickel plating film

Abstract: An object of the present invention is to provide an electroless nickel plating solution that can form a nickel film which can surely cover a surface of a copper material even when the film thickness is thin, and a method for forming a nickel film using the electroless nickel plating solution. In order to solve the above-mentioned problems, the electroless nickel strike plating solution used for forming the nickel film on the surface of the copper material includes: a water-soluble nickel salt in a concentration of 0.002 to 1 g/L in terms of nickel; one or more carboxylic acids or salts thereof; and one or more reducing agents selected from the group of dimethylamine borane, trimethylamine borane, hydrazine and hydrazine derivatives.

Surface metallization method for antenna oscillator

Abstract: The invention discloses a surface metallization method for an antenna oscillator. The surface metallization method comprises the following steps of (1), forming; (2), ultrasonic cleaning; (3), chemical roughening; (4), neutralizing; (5), presoaking; (6), palladium activation; (7), peptizing; (8), electroless copper plating; (9), separation line laser carving; (10), ultrasonic cleaning; (11), acidpickling; (12), pyrophosphate copper electroplating; (13), acid copper electroplating; (14), chemical copper removal; (15), acid pickling; (16), matte tin electroplating; (17), neutralizing; and (18),tin protection. According to the surface metallization method for the antenna oscillator, chemical roughening treatment and palladium activation treatment are carried out on the surface of an oscillator body, so that electroless copper plating treatment is directly carried out on the surface of the oscillator, and then electroless nickel plating is replaced; due to the fact that the metal purityof an electroless plated copper layer is higher, the signal transmission loss of the oscillator is reduced, and the later electroplating skip plating phenomenon is avoided; and the electroless platedcopper layer and an electroplated copper layer are two same metals, so that the binding force between the electroplated copper layer and the electroless plated copper layer is stronger, and the quality of the prepared oscillator is better.

EFFECTS OF Pd2+ CONCENTRATION ON THE STRUCTURAL PROPERTY OF NICKEL-PLATED PLANT FIBER NON-WOVEN SHEET

Abstract: In this work, a facile method combined with PdCl2 solution immersing and electroless deposition to fabricate nickel-plated plant fiber non-woven sheet is demonstrated. The effect of Pd2+ concentrat...

Effect of pretreatment on the microstructure of multiwalled carbon nanotubes

Abstract: Four kinds of multi-walled carbon nanotubes pretreated by different methods were studied. Chemically functionalized (hydroxylation and carboxylation) CNTs were prepared by oxidizing original CNTs in H2SO4 solutions of different temperatures and concentrations by KMnO4. Graphitized CNTs were prepared by heat-treating original CNTs in an inert gas at 2800°C for 20 hours. CNTs Nickel plating on the surface was obtained by electroless plating. The effect of pretreatment on the surface state and microstructure of carbon nanotubes was also studied. The results showed that Chemical functionalization could form some functional groups on the surface of CNTs, which could not only improve the compatibility of CNTs with some solvents, but also purified CNTs, which had a positive effect on the preparation of composite materials. High-temperature graphitization treatment could significantly increase the degree of crystallization of carbon nanotubes and reduce structural defects. After electroless nickel plating, evenly distributed nano-sized metal particles were formed on the surface of the CNTs, and the interface between the two was well bonded.