Jing Zhang

TL;DR: In this paper, the most recent progress in this field is reviewed, covering the integration approaches of III-V-to-silicon bonding, transfer printing, epitaxial growth and the use of colloidal quantum dots.

TL;DR: In this paper, the authors review the work on heterogeneous III-V-on-silicon photonic components and circuits for applications in optical communication and sensing and elaborate on the integration strategy and describe a broad range of devices realized on this platform.

TL;DR: A promising technology, micro-transfer-printing (μTP), is discussed, which can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs.

TL;DR: An electrically pumped DFB laser integrated on and coupled to a silicon waveguide circuit is demonstrated by transfer printing a 40 × 970 μm2 III-V coupon, defined on aIII-V epitaxial wafer, allowing for the very efficient use of the III- V material and the massively parallel integration of these coupons on a silicon photonic integrated circuit wafer.

TL;DR: In this article, a compact fiber Bragg grating (FBG) vibration sensor consisting of a flat diaphragm and two L-shaped rigid cantilever beams for seismic measurement has been proposed and experimentally demonstrated.