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Jingbo Li

Researcher at Beijing Institute of Technology

Publications -  465
Citations -  22526

Jingbo Li is an academic researcher from Beijing Institute of Technology. The author has contributed to research in topics: Band gap & Heterojunction. The author has an hindex of 61, co-authored 403 publications receiving 17623 citations. Previous affiliations of Jingbo Li include Centre national de la recherche scientifique & University of Science and Technology Beijing.

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The synthesis of hierarchical nanostructured MoS 2 /Graphene composites with enhanced visible-light photo-degradation property

TL;DR: In this paper, a hierarchical MoS 2 /Graphene nanocomposite with hierarchical nanostructure was successfully synthesized employing a one-step hydrothermal method, which achieved relatively higher degradation rate of 99% in 28min for methylene blue (MB) and 50min for Rhodamine (RHB).
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X-ray diffraction analysis and specific heat capacity of (Bi1−xLax)FeO3 perovskites

TL;DR: In this article, the phase boundaries of the antiferromagnetic-paramagnetic transition were determined by temperature-dependent X-ray diffraction and the temperature dependences of expansion coefficients of the samples were obtained.
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Tuning Magnetic Properties of α-MnO2 Nanotubes by K+ Doping

TL;DR: In this paper, the authors synthesize α-KxMnO2 nanotubes with x = 0.10, 0.15, and 0.17 and show that they exhibit a charge separation transition from mixed/averaged valence state manganese ions to Mn3+ and Mn4+ between 250 and 300 K.
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Effects of strain on the band gap and effective mass in two-dimensional monolayer GaX (X = S, Se, Te)

TL;DR: In this article, first-principles calculations have been performed to study the mechanical and electronic properties of two-dimensional monolayer GaX (X = S, Se, Te) under strain.
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Tunable Schottky barrier width and enormously enhanced photoresponsivity in Sb doped SnS 2 monolayer

TL;DR: In this article, a two-dimensional SnS2 nanosheets with well-controlled Sb doping concentration via direct vapor growth approach and following micromechanical cleavage process are presented.