다중혈관 관상동맥 환자에서 y-문합을 이용하여 양쪽 내흉동맥만을 사용한 우회술의 조기 성적

Graphene based materials: Past, present and future

Molecular self-assembly is the spontaneous association of molecules under equilibrium conditions into stable, structurally well-defined aggregates joined by noncovalent bonds. Molecular self-assembly is ubiquitous in biological systems and underlies the formation of a wide variety of complex biological structures. Understanding self-assembly and the associated noncovalent interactions that connect complementary interacting molecular surfaces in biological aggregates is a central concern in structural biochemistry. Self-assembly is also emerging as a new strategy in chemical synthesis, with the potential of generating nonbiological structures with dimensions of 1 to 10(2) nanometers (with molecular weights of 10(4) to 10(10) daltons). Structures in the upper part of this range of sizes are presently inaccessible through chemical synthesis, and the ability to prepare them would open a route to structures comparable in size (and perhaps complementary in function) to those that can be prepared by microlithography and other techniques of microfabrication.

Molecular self-assembly and nanochemistry: A chemical strategy for the synthesis of nanostructures

Glacial melting in the Tibetan Plateau affects the water resources of millions of people. This study finds that—partly owing to changes in atmospheric circulations and precipitation patterns—the most intensive glacier shrinkage is in the Himalayan region, whereas glacial retreat in the Pamir Plateau region is less apparent.

Different glacier status with atmospheric circulations in Tibetan Plateau and surroundings

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Flexible and Stretchable Wireless Systems

With the increased global population, smart living is an increasingly important criteria to ensure equal opportunities for all. Therefore, what is Smart Living? The first time when we tossed this terminology seven years back, we thought reducing complexities in human life. Today we believe it more. However, smart living for all complicates the technological need further. As by all, we mean any age group, any academic background and any financial condition. Although electronics are powerful today and have enabled our digital world, many as of today have not experienced that progress. Going forward while we realize more and more electronics in our daily life, the most important question would be how. Here we show, a heterogeneous integration approach to integrate low-cost high performance interactive electronic system which are physically compliant. We are redesigning electronics to redefine its purposes to reconfigure life for all to enable smart living.

/pdf/democratized-electronics-to-enable-smart-living-for-all-4hn6em6n7y.pdf

Democratized electronics to enable smart living for all

Flexible and stretchable electronics has emerged as a promising field in the past decade, especially towards healthcare and environmental monitoring applications. We have witnessed significant progress in developing flexible sensors, logic/memory devices (transistors), communication modules, energy sources, and alternate materials to enhance performance with added physical conformity. However, there are unaddressed challenges in matching status-quo CMOS-based electronics, packaging, reliable flexible interconnects, and lack of pragmatic integration schemes to readily complement the existing state-of-the-art technology. Moreover, often rigid ICs are used on flexible polymeric substrates placed sparsely, making the system bendable with a caveat of reduced area efficiency. Hence, we present a CMOS compatible heterogeneous integration scheme with a unique 3D coin architecture to obtain truly flexible electronic systems. This integration sequence has multiple polymeric layers that resemble a coin with two faces and a sandwich layer. The bottom face of the coin hosts flexible sensors while the top face is reserved for communication (antenna) and energy harvester (flexible solar cell), and the associated electronic ICs (microcontroller, RF IC, solid-state micro-batteries) are embedded in the sandwich layer (all components in the flexible form). We use the modular-LEGO approach for the assembly of bare die ICs like a lock-and-key mechanics in plug and play manner to obtain reliable, flexible interconnects and accurate assembly. These multiple layers are connected electrically using vertical through-polymer-via (TPV) that shows less than 4% overall change in the resistance across the longest metallic interconnect layer trace. This vertical TPV interconnection helps in maximizing area usage, thereby increasing area efficiency. We transformed the commercial CMOS based 16 MHz microprocessor bare die and an array of micro-batteries with a rating of $\mathrm{5}\ \mu\text{Ah}$ @ 3.9V into ultrathin ( $ ) flexible form after assembly of thicker dies ( $\mathrm{200}-\mathrm{300}\ \mu\mathrm{m}$ ) into the LEGO sites. It can integrate a solar cell on top face after following the corrugation approach of converting rigid solar cells into a flexible one. At the same time, the antenna for communication and the TPV are fabricated using electrochemical deposition technique. The overall thickness of the 3D-coin system is less than 1 mm and free from any rigid component making it flexible up to a bending radius of ∼1 mm. Soft-polymeric encapsulation provides mechanical strength, reduces stresses, and improves ruggedness for the stand-alone electronic system. Thus, we believe our 3D heterogeneous integration strategy offers a pragmatic approach to obtaining truly flexible electronic systems without compromising next-generation electronic systems' performance aspects.

/pdf/3d-heterogeneous-integration-strategy-for-physically-3c9esnmw46.pdf

3D Heterogeneous Integration Strategy for Physically Flexible CMOS Electronic Systems

A sensor system (100) includes at least one sensor (102) configured to detect at least one environmental parameter, a processor (104) coupled to the at least one sensor, and a dissolvable polymer (112) encasing the sensor system.

Dissolvable sensor system for environmental parameters

https://www.onlinelibrary.wiley.com/doi/pdf/10.1002/smll.201870022

Muhammad Mustafa Hussain

Papers

Flexible and Stretchable Wireless Systems

Democratized electronics to enable smart living for all

3D Heterogeneous Integration Strategy for Physically Flexible CMOS Electronic Systems

Dissolvable sensor system for environmental parameters

Photonics: Enhanced Performance of MoS2 Photodetectors by Inserting an ALD-Processed TiO2 Interlayer (Small 5/2018)