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Muhammad Mustafa Hussain

Researcher at King Abdullah University of Science and Technology

Publications -  333
Citations -  6943

Muhammad Mustafa Hussain is an academic researcher from King Abdullah University of Science and Technology. The author has contributed to research in topics: Silicon & Metal gate. The author has an hindex of 39, co-authored 330 publications receiving 5355 citations. Previous affiliations of Muhammad Mustafa Hussain include University of California, Berkeley & SEMATECH.

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Proceedings ArticleDOI

Alternative approaches for high-k/metal gate CMOS: Low temperature process (gate last) and SiGe channel

TL;DR: In this article, a comprehensive materials set has been fabricated and characterized to address the challenging issues in both gate first and gate last HK/MG CMOS, where metal gate thermal budget and channel composition are shown to be effective methods to engineer pMetal effective work function for gate last and gate first, respectively.
Journal ArticleDOI

Role of metal/silicon semiconductor contact engineering for enhanced output current in micro-sized microbial fuel cells

TL;DR: In this paper, contact engineering plays an important role to extract the maximum performance from energy harvesters like microbial fuel cells (MFCs), and the authors experimented with Schottky and Ohmic methods of fabricating contact areas on silicon in an MFC contact material study.
Journal ArticleDOI

SiSn diodes: Theoretical analysis and experimental verification

TL;DR: In this article, the authors reported a theoretical analysis and experimental verification of change in band gap of silicon lattice due to the incorporation of tin (Sn), and they formed SiSn ultra-thin film on the top surface of a 4 in. silicon wafer using thermal diffusion of Sn.
Proceedings ArticleDOI

Dual work function high-k/Metal Gate CMOS FinFETs

TL;DR: In this paper, a set of complementary metal oxide semiconductor (CMOS) FinFET devices with two different high-k/metal gate stacks of dual work function has been integrated on the same wafer to overcome the integration complexity.