Muhammad Mustafa Hussain

TL;DR: In this paper, a cost effective CMOS compatible process for transforming conventional rigid Ge metal oxide semiconductor capacitors (MOSCAPS) into a mechanically flexible and semi-transparent platform is presented.

TL;DR: In this paper, the authors report short circuit current enhancement in crystalline silicon photovoltaic (C-Si) using low-cost Ohmic contact engineering by integration of Nickel mono-silicide (NiSi) for back contact metallization as an alternative to using expensive screen printed silver (Ag).

TL;DR: In this article, a method of fabricating a thermal management device is described, which includes depositing a seed layer, using a seed-layer depositing technique, on a side of a support base, growing a heat sink base layer on the side of the seed layer; depositing the hard mask on the support base directly opposite that containing the seed and heat-sink base layers; patterning the hard masks with a photoresist mask; etching the patterned hard mask with an etching technique.

TL;DR: In this paper, a generic low-cost regenerative batch fabrication process is utilized to transform rigid magnetic tunnel junctions (MTJ) on a 500 µm silicon wafer substrate into 5 µm thin, mechanically flexible silicon devices, and ensuring optimal utilization of the whole substrate.

TL;DR: This work focuses on implantable electronics (brain machine interface) and its integration strategy enabled by CMOS device design and technology run path and can potentially stick high quality CMOS electronics on any existing objects and embed them into any future objects that will be made.