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Muhammad Mustafa Hussain

Researcher at King Abdullah University of Science and Technology

Publications -  333
Citations -  6943

Muhammad Mustafa Hussain is an academic researcher from King Abdullah University of Science and Technology. The author has contributed to research in topics: Silicon & Metal gate. The author has an hindex of 39, co-authored 330 publications receiving 5355 citations. Previous affiliations of Muhammad Mustafa Hussain include University of California, Berkeley & SEMATECH.

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Journal ArticleDOI

Metal coated polymer and paper-based cantilever design and analysis for acoustic pressure sensing

TL;DR: In this paper, the effect of the aspect ratio on the resonant frequency, response time, mechanical sensitivity, and capacitive sensitivity of a cantilever-based acoustic pressure sensor was analyzed.
Proceedings ArticleDOI

Solid state MEMS devices on flexible and semi-transparent silicon (100) platform

TL;DR: In this paper, the authors reported fabrication of MEMS thermal actuators on flexible and semi-transparent silicon fabric released from bulk silicon (100) and then performed chemical mechanical polishing to reuse the remaining wafer.
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Enhanced Photoresponse of WS2 Photodetectors through Interfacial Defect Engineering Using a TiO2 Interlayer

TL;DR: In this article, a stable and reliable two-dimensional (2D) tungsten disulfide (WS2)-based photodetector (PD) was developed to address the issue of interfacial defects that are unavoidably formed at tungststen disulide (TDS) point.
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In-plane and out-of-plane structural response of spiral interconnects for highly stretchable electronics

TL;DR: In this paper, the authors demonstrate the in-depth structural response of the spiral-island system when subjected to in-plane and out-of-plane stretchings and show the strain contours for spirals connected in-series.
Journal ArticleDOI

Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

TL;DR: In this article, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical "through silicon" micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads.