다중혈관 관상동맥 환자에서 y-문합을 이용하여 양쪽 내흉동맥만을 사용한 우회술의 조기 성적

Graphene based materials: Past, present and future

Molecular self-assembly is the spontaneous association of molecules under equilibrium conditions into stable, structurally well-defined aggregates joined by noncovalent bonds. Molecular self-assembly is ubiquitous in biological systems and underlies the formation of a wide variety of complex biological structures. Understanding self-assembly and the associated noncovalent interactions that connect complementary interacting molecular surfaces in biological aggregates is a central concern in structural biochemistry. Self-assembly is also emerging as a new strategy in chemical synthesis, with the potential of generating nonbiological structures with dimensions of 1 to 10(2) nanometers (with molecular weights of 10(4) to 10(10) daltons). Structures in the upper part of this range of sizes are presently inaccessible through chemical synthesis, and the ability to prepare them would open a route to structures comparable in size (and perhaps complementary in function) to those that can be prepared by microlithography and other techniques of microfabrication.

Molecular self-assembly and nanochemistry: A chemical strategy for the synthesis of nanostructures

Glacial melting in the Tibetan Plateau affects the water resources of millions of people. This study finds that—partly owing to changes in atmospheric circulations and precipitation patterns—the most intensive glacier shrinkage is in the Himalayan region, whereas glacial retreat in the Pamir Plateau region is less apparent.

Different glacier status with atmospheric circulations in Tibetan Plateau and surroundings

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

We report an ultra-low cost flexible proximity sensor using only off-the-shelf recyclable materials such as aluminum foil, napkin and double-sided tape. Unlike previous reports, our device structure exhibits two sensing capabilities in one platform, with outstanding long detection range of 20 cm and pressure sensitivity of 0.05 kPa−1. This is the first ever demonstration of a low-cost, accessible, and batch manufacturing process for pressure and proximity sensing on a singular platform. The mechanical flexibility of the sensor makes it possible to mount on various irregular platforms, which is vital in many areas, such as robotics, machine automation, vehicular technology and inspection tools.

/pdf/affordable-dual-sensing-proximity-sensor-for-touchless-4opv1ssqxo.pdf

Affordable dual-sensing proximity sensor for touchless interactive systems

In today's world, consumer driven technology wants more portable electronic gadgets to be developed, and the next big
thing in line is self-powered handheld devices. Therefore to reduce the power consumption as well as to supply sufficient
power to run those devices, several critical technical challenges need to be overcome:
a. Nanofabrication of macro/micro systems which incorporates the direct benefit of light weight (thus portability), low
power consumption, faster response, higher sensitivity and batch production (low cost).
b. Integration of advanced nano-materials to meet the performance/cost benefit trend. Nano-materials may offer new
functionalities that were previously underutilized in the macro/micro dimension.
c. Energy efficiency to reduce power consumption and to supply enough power to meet that low power demand.
We present a pragmatic perspective on a self-powered integrated System on Chip (SoC). We envision the integrated
device will have two objectives: low power consumption/dissipation and on-chip power generation for implementation
into handheld or remote technologies for defense, space, harsh environments and medical applications. This paper
provides insight on materials choices, intelligent circuit design, and CMOS compatible integration.

/pdf/self-powered-integrated-systems-on-chip-energy-chip-3ob1zw9noh.pdf

Self-powered integrated systems-on-chip (energy chip)

High performance computation with longer battery lifetime is an essential component in our today's digital electronics oriented life. To achieve these goals, field effect transistors based complementary metal oxide semiconductor play the key role. One of the critical requirements of transistor structure and fabrication is efficient contact engineering. To catch up with high performance information processing, transistors are going through continuous scaling process. However, it also imposes new challenges to integrate good contact materials in a small area. This can be counterproductive as smaller area results in higher contact resistance thus reduced performance for the transistor itself. At the same time, discovery of new one or two-dimensional materials like nanowire, nanotube, or atomic crystal structure materials, introduces new set of challenges and opportunities. In this paper, we are reviewing them in a synchronized fashion: fundamentals of contact engineering, evolution into non-planar field effect transistors, opportunities and challenges with one and two-dimensional materials and a new opportunity of contact engineering from device architecture perspective.

Contact engineering for nano-scale CMOS

Fabrication of three-dimensional MIS nano-capacitor based on nano-imprinted single crystal silicon nanowire arrays

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202170023

Flexible Capacitive Pressure Sensors: Recent Progress on Flexible Capacitive Pressure Sensors: From Design and Materials to Applications (Adv. Mater. Technol. 4/2021)

Muhammad Mustafa Hussain

Papers

Affordable dual-sensing proximity sensor for touchless interactive systems

Self-powered integrated systems-on-chip (energy chip)

Contact engineering for nano-scale CMOS

Fabrication of three-dimensional MIS nano-capacitor based on nano-imprinted single crystal silicon nanowire arrays

Flexible Capacitive Pressure Sensors: Recent Progress on Flexible Capacitive Pressure Sensors: From Design and Materials to Applications (Adv. Mater. Technol. 4/2021)