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An ultra-lightweight design for imperceptible plastic electronics

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TLDR
In this paper, the authors present a platform that makes electronics both virtually unbreakable and imperceptible on polyimide polysilicon elastomers, which can be operated at high temperatures and in aqueous environments.
Abstract
Electronic devices have advanced from their heavy, bulky origins to become smart, mobile appliances. Nevertheless, they remain rigid, which precludes their intimate integration into everyday life. Flexible, textile and stretchable electronics are emerging research areas and may yield mainstream technologies. Rollable and unbreakable backplanes with amorphous silicon field-effect transistors on steel substrates only 3 μm thick have been demonstrated. On polymer substrates, bending radii of 0.1 mm have been achieved in flexible electronic devices. Concurrently, the need for compliant electronics that can not only be flexed but also conform to three-dimensional shapes has emerged. Approaches include the transfer of ultrathin polyimide layers encapsulating silicon CMOS circuits onto pre-stretched elastomers, the use of conductive elastomers integrated with organic field-effect transistors (OFETs) on polyimide islands, and fabrication of OFETs and gold interconnects on elastic substrates to realize pressure, temperature and optical sensors. Here we present a platform that makes electronics both virtually unbreakable and imperceptible. Fabricated directly on ultrathin (1 μm) polymer foils, our electronic circuits are light (3 g m(-2)) and ultraflexible and conform to their ambient, dynamic environment. Organic transistors with an ultra-dense oxide gate dielectric a few nanometres thick formed at room temperature enable sophisticated large-area electronic foils with unprecedented mechanical and environmental stability: they withstand repeated bending to radii of 5 μm and less, can be crumpled like paper, accommodate stretching up to 230% on prestrained elastomers, and can be operated at high temperatures and in aqueous environments. Because manufacturing costs of organic electronics are potentially low, imperceptible electronic foils may be as common in the future as plastic wrap is today. Applications include matrix-addressed tactile sensor foils for health care and monitoring, thin-film heaters, temperature and infrared sensors, displays, and organic solar cells.

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Journal ArticleDOI

Large Area One-Step Facile Processing of Microstructured Elastomeric Dielectric Film for High Sensitivity and Durable Sensing over Wide Pressure Range

TL;DR: A facile approach is developed for one-step processing of a large area microstructured elastomer film with high density microfeatures of air voids, which can be seamlessly integrated into the process flow for fabricating flexible capacitive sensors that exhibit fast response and high sensitivity in the low pressure range.
Journal ArticleDOI

Sol-gel metal oxide dielectrics for all-solution-processed electronics

TL;DR: In this article, the authors present a comprehensive review of sol-gel MOx dielectric materials with a specific focus on the extensive categorization of their structures/compositions and advanced approaches for realizing ultimate material properties and next-generation device platforms.
Journal ArticleDOI

Recent Progress on Printed Flexible Batteries: Mechanical Challenges, Printing Technologies, and Future Prospects

TL;DR: In this paper, the authors discuss material challenges and mechanical limits of flexible printed batteries and present examples of batteries printed using these methods and briefly discuss other novel non-printed compliant batteries that have unique mechanical form.
Journal ArticleDOI

Ultrathin Quantum Dot Display Integrated with Wearable Electronics

TL;DR: In this article, an ultrathin QD light-emitting diodes (QLEDs) with relatively thick shells are employed to improve electroluminescence (EL) characteristics by suppressing the nonradiative recombination.
Journal ArticleDOI

Cephalopod‐Inspired Miniaturized Suction Cups for Smart Medical Skin

TL;DR: This paper presents a meta-modelling study of how nanoparticle-based approaches to materials engineering changed under the influence of EMTs, and some of the techniques used in this study were developed under the supervision of Prof. J.M. Kim.
References
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Journal ArticleDOI

Materials and mechanics for stretchable electronics

TL;DR: Inorganic and organic electronic materials in microstructured and nanostructured forms, intimately integrated with elastomeric substrates, offer particularly attractive characteristics, with realistic pathways to sophisticated embodiments, and applications in systems ranging from electronic eyeball cameras to deformable light-emitting displays are described.
Journal ArticleDOI

Skin-like pressure and strain sensors based on transparent elastic films of carbon nanotubes

TL;DR: Transparent, conducting spray-deposited films of single-walled carbon nanotubes are reported that can be rendered stretchable by applying strain along each axis, and then releasing this strain.
Journal ArticleDOI

A high-mobility electron-transporting polymer for printed transistors

TL;DR: A highly soluble and printable n-channel polymer exhibiting unprecedented OTFT characteristics under ambient conditions in combination with Au contacts and various polymeric dielectrics is reported and all-printed polymeric complementary inverters have been demonstrated.
PatentDOI

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

TL;DR: In this article, the authors present stretchable and printable semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed, or otherwise deformed.
Journal ArticleDOI

Stretchable and foldable silicon integrated circuits.

TL;DR: A simple approach to high-performance, stretchable, and foldable integrated circuits that integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates.
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