Journal ArticleDOI
Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy
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TLDR
The results show that the microstructure of Sn–Cu–Al solder alloy is refined by Al, and the superior mechanical properties of Sn-0.7Cu–0.075Al are guaranteed by the refined microst structure, the dispersed IMC and the uniform stress distribution.About:
This article is published in Microelectronics Reliability.The article was published on 2015-02-01. It has received 20 citations till now. The article focuses on the topics: 6111 aluminium alloy & Alloy.read more
Citations
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Journal ArticleDOI
Structure and properties of Sn-Cu lead-free solders in electronics packaging
TL;DR: The evolution law of the internal structure of solder alloy/solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced and it was clear that with the addition of 0.05% Pr, the thickness of IMC layer decreases significantly and the formation of voids at the interface is inhibited.
Journal ArticleDOI
Study on the Reliability of Carbon Nanotube-Reinforced Sn-58Bi Lead-Free Solder Joints
TL;DR: In this article, the wettability, microstructure and mechanical properties of multi-walled carbon nanotube (CNT)-reinforced Sn-58Bi composite solder joints were investigated.
Journal ArticleDOI
Effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of Sn-0.7Cu alloy
Jianglei Fan,Zhanyun Liu,Hengtao Zhai,Xiao Wang,Yan Wang,Ying Li,Xiangkui Zhou,Wu Shen,Jianxiu Liu +8 more
TL;DR: In this article, the effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of lead-free solder was studied, and it was shown that with the addition of Co, a small amount of CoSn phase formed in Sn-0.7Cu-xCo solders, and the morphology of Cosn2 phase changes from small blocks to flake like, short rod-like, and then to massive bulk shape.
Journal ArticleDOI
Microstructure and reliability of Mo nanoparticle reinforced Sn–58Bi-based lead-free solder joints
TL;DR: In this paper, the effect of Mo nanoparticles on the microstructure, wettability and mechanical properties of Sn-58Bi-xMo (x = 0-2.00) solder joints was investigated.
Journal ArticleDOI
Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu- xNi/Cu Solder Joints
TL;DR: In this article, the effect of the Ni concentration on the microstructure, wettability, and tensile properties of composite composite solder joints was investigated, and the results showed that refined dot-shaped particles of intermetallic compounds (IMCs) are uniformly dispersed in a primary β-sn matrix in the Cu/Sn-0.7Cu-xNi/Cu solder joints.
References
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Journal ArticleDOI
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Kejun Zeng,King-Ning Tu +1 more
TL;DR: In this paper, the authors used the format of case study to review six reliability problems of Pb-free solders in electronic packaging technology and conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes.
Journal ArticleDOI
A review : On the development of low melting temperature Pb-free solders
TL;DR: This review discusses fundamental research activity and its focus on the solidification and interfacial reactions of Sn-based solder systems, and first explains the reactions between common base materials, coatings, and metallisations, and then proceed to more complex systems with additional alloying elements.
Journal ArticleDOI
Contact Deformation Regimes Around Sharp Indentations and the Concept of the Characteristic Strain
TL;DR: In this article, a finite element simulation is performed to analyze the contact deformation regimes induced by a sharp indenter in elastic-power-law plastic solids, where piling-up of material at the contact area is correlated with uniaxial mechanical properties.
Journal ArticleDOI
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers
TL;DR: It is shown that the latter group of elements have stronger effect on the growth behaviour of IMC’s in the Sn–Cu system than those belonging to the first group.
Journal ArticleDOI
Effect of Heat Treatment on Niobium Segregation of Laser-Cladded IN718 Alloy Coating
TL;DR: In this paper, an IN718 alloy was prepared by high-power diode laser cladding and a standard heat treatment and direct aging (DA) were employed to improve the properties of this coating.
Related Papers (5)
Effect of Al on the microstructure and properties of Sn–0.7Cu solder alloy
Zhongmin Lai,Dan Ye +1 more