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Formation of Germanium Dioxide During Wet Oxidation of Si0.5 Ge0.5 Alloy

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TLDR
In this paper, the authors investigated the oxidation of Si 0.5 Ge 0.5 alloy over the temperature range 800 to 1000°C and determined the composition of the oxide layers by 1.5 MeV Rutherford backscattering spectroscopy (RBS), IR and X-ray XPS.
Abstract
The oxidation of Si 0.5 Ge 0.5 alloy has been investigated over the temperature range 800 to 1000°C . The composition of the oxide layers has been determined by 1.5 MeV Rutherford backscattering spectroscopy (RBS), infrared transmission spectroscopy (IR) and X-ray photoelectron spectroscopy (XPS). During the initial stage of oxidation, as the temperature ramps up in an oxidising ambient both Si and Ge are oxidized to form a mixed oxide in the region near the surface. Upon further oxidation, at temperatures higher than 900°C and times longer than 5 minutes, the Ge atoms are ejected by the growing oxide layer, which has the composition of Si0 2 , and accumulate in the underlying alloy, which becomes rich in Ge.The surface oxide layer remains unchanged. The proportion of Ge0 2 in the near surface region, determined from IR spectra, decreases when the temperatures increases from 800°C to 1000°C. It is concluded that at 800°C Ge atoms are insufficiently mobile to be ejected from the growing oxide and both matrix species ( Si and Ge ) have equal probabilities of oxidation leading to the formation an oxide of composition Si 0.5 Ge 0.5 O 2 . Supporting experiments confirm that Ge0 2 in the surface layer is formed during warm up of the samples oxidized at 900 and 1000°C.

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Journal ArticleDOI

Kinetics of wet oxidation at 1000 °C of Si0.5Ge0.5 relaxed alloy

TL;DR: In this paper, the authors investigated the wet oxidation at 1000 °C of Si0.5Ge 0.5 relaxed alloy layers using Rutherford backscattering spectrometry and found that the capped alloy layer oxidizes at the same rate as the bulk silicon.
Journal ArticleDOI

Engineering of dense arrays of Vertical Si1-x Ge x nanostructures

TL;DR: In this article , a top-down fabrication of highly anisotropic and ultra-dense Si1-x Ge x (x = 0, 0.2,0.5) VNCAs is presented, and the impact of the nanostructured shape (wire or sheet), size and Ge content on the oxide growth are investigated and analyzed in detail through transmission electron microscopy.
References
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Journal ArticleDOI

General Relationship for the Thermal Oxidation of Silicon

TL;DR: In this paper, the thermaloxidation kinetics of silicon are examined in detail based on a simple model of oxidation which takes into account the reactions occurring at the two boundaries of the oxide layer as well as the diffusion process, the general relationship x02+Ax0=B(t+τ) is derived.
Journal ArticleDOI

Oxidation studies of SiGe

TL;DR: In this paper, the authors studied the kinetics and mechanism of oxidation of SiGe alloys deposited epitaxially onto Si substrates by low-temperature chemical vapor deposition and demonstrated that Ge plays a purely catalytic role, i.e., it enhances the reaction rate while remaining unchanged itself.
Journal ArticleDOI

Kinetics and mechanism of oxidation of SiGe: dry versus wet oxidation

TL;DR: It is demonstrated that the role of Ge is to suppress the formation of Si interstitials and that this is the rate limiting step in cases of rapid oxidation.
Journal ArticleDOI

Oxidation of Si1−xGex alloys at atmospheric and elevated pressure

TL;DR: In this paper, the authors explored the fundamental differences in the thermodynamics of the process and the kinetics of the oxidation reaction of alloys of Si1−xGex.
Journal ArticleDOI

Diffusion versus oxidation rates in silicon‐germanium alloys

TL;DR: In this article, the authors studied the oxidation of SiGe alloys of different compositions (between 25 and 75 at.% Ge) and found that after extended oxidation, the decrease of Si concentration at the interface slowed down oxidation rates enough so that eventually, the oxide thickness for the SiGeAlloys ends up smaller than that of pure Si.
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