Journal ArticleDOI
Formation of silicon tips with <1 nm radius
R. B. Marcus,T. S. Ravi,T. J. Gmitter,Ken K. Chin,D. Liu,W.J. Orvis,D.R. Ciarlo,Charles E. Hunt,J.T. Trujillo +8 more
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TLDR
In this paper, a method has been found for preparing uniform silicon tips with a radius of curvature less than 1 nm, formed by oxidation of 5μm-high silicon cones through exploitation of a known oxidation inhibition of silicon at regions of high curvature.Abstract:
Electron emitters in vacuum microelectronic devices need sharp tips in order to permit electron emission at moderate voltages A method has been found for preparing uniform silicon tips with a radius of curvature less than 1 nm These tips are formed by oxidation of 5‐μm‐high silicon cones through exploitation of a known oxidation inhibition of silicon at regions of high curvatureread more
Citations
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Hydrogen Fuel Cells and Monitoring Bioconversion Processes
TL;DR: The combination of reactive ion etching with focused ion beam milling and material deposition allows for the generation of a new class of electrochemical probes capable of mapping biochemical reactions inside cell membranes.
Proceedings ArticleDOI
X-ray diode using a silicon field-emission photocathode
TL;DR: In this paper, the first use of etched, point arrays for generating electrons for x-ray sources was described, which was also used to produce AlK(alpha) x rays.
Journal ArticleDOI
Surface Treatment on Silicon Field-Emission Cathodes
TL;DR: In this article, p-type silicon micro-emitters have been formed using a subtractive tip fabrication technique using a flat Si anode, spaced nominally 6 μm and 150 μm from the cathode, for field emission characteristics are measured in a high vacuum chamber at a pressure range between 10−5 and 10−8 Torr.
Journal ArticleDOI
Fabrication and characterization of dual AFM probe with narrow-gapped silicon tips and switchable cantilevers with magneto-strictive FePd film actuator
TL;DR: In this article, a dual probe for atomic force microscopic (AFM) in-situ imaging and mechanical operation for cutting of bio-molecules is presented, which has narrow-gapped twin sharp silicon tips and cantilevers on which Fe 60 Pd 40 magneto-strictive film actuators are stacked for cantilever switching.
References
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Journal ArticleDOI
Two-dimensional thermal oxidation of silicon. II. Modeling stress effects in wet oxides
TL;DR: In this paper, the authors proposed a simplified mathematical formulation made possible by the symmetry in cylindrical structures, and compared with experimental data, possible applications, and limitations of the model are also discussed.
Journal ArticleDOI
Two-dimensional thermal oxidation of silicon—I. Experiments
TL;DR: In this article, the authors introduced a unique experimental approach in which extensive data were obtained concerning the oxidation of cylindrical silicon structures of controlled radii of curvature, and quantitatively demonstrated that the oxidization of curved silicon surfaces is retarded at low temperatures and sharp curvatures, and the retardation is more severe on concave than convex structures.
Journal ArticleDOI
The Oxidation of Shaped Silicon Surfaces
R. B. Marcus,T. T. Sheng +1 more
TL;DR: In this article, a 30% decrease in oxide thickness at silicon step edges following 900° and 950°C wet oxidation is attributed to the effect of locally compressive intrinsic stress within the oxide on the solubility of oxygen.
Journal ArticleDOI
Nonplanar oxidation and reduction of oxide leakage currents at silicon corners by rounding-off oxidation
K. Yamabe,K. Imai +1 more
TL;DR: In this paper, the curvature radius at the convex corner of a trenched Si surface and electric field intensification was modeled as a rounding-off oxidation, and a simple one-dimensional model that considered both stress generation during Si oxidation and stress relaxation by oxide viscous flow was proposed.
Journal ArticleDOI
The application of thin-film field-emission cathodes to electronic tubes
I. Brodie,C.A. Spindt +1 more
TL;DR: In this paper, the emission properties of arrays of field emission cathodes, fabricated using thin film technology and micro-lithography, were reviewed and it was argued that from the standpoint of life, stability, energy distribution, current fluctuation noise, and average current density over the array, these cathodes have demonstrated sufficient promise to justify their trial use in a range of electronic devices.