Journal ArticleDOI
IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms
Ousama M. Abdelhadi,Leila Ladani +1 more
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TLDR
In this paper, the growth kinetics of intermetallic (IMC) compound layers formed between Sn-3.5Ag solders and Cu substrate in soldering process are investigated experimentally and analytically.About:
This article is published in Journal of Alloys and Compounds.The article was published on 2012-10-05. It has received 98 citations till now.read more
Citations
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Journal ArticleDOI
Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates
TL;DR: In this article, the effects of strain rate on the shear fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints with thin and thick interfacial intermetallic compound layers were investigated.
Journal ArticleDOI
Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints
Mrunali Sona,K. N. Prabhu +1 more
TL;DR: In this paper, the authors study the evolution of microstructural phases in commonly used lead free xSn-yAg-zCu solders and various factors such as substrate, minor alloying, mechanical and thermo-mechanical strains which affect the microstructure.
Journal ArticleDOI
Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds
TL;DR: In this article, the precipitation behavior of Cu 6 Sn 5 during the solidification of Sn-based solders/Cu joints and its effect on the growth of interfacial intermetallic compounds (IMCs) was studied.
Journal ArticleDOI
Investigation of diffusion behavior in Cu–Sn solid state diffusion couples
TL;DR: In this paper, the diffusion behaviors and diffusion parameters of intermetallic compounds (IMCs) formed in Cu-Sn diffusion couples were investigated at the temperature range of 130°C-200°C.
Journal ArticleDOI
Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures
Qingqian Li,Y.C. Chan +1 more
TL;DR: In this article, the evolution of the intermetallic compounds (IMCs) was studied in ultra-thin (sub-micrometre thickness) solder layer samples: Sn-Cu binary and Cu-Sn-Cu sandwich structures for chip-stacking interconnections.
References
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Book
Macro- to Microscale Heat Transfer: The Lagging Behavior
TL;DR: In this paper, a dual-phase-leg model is proposed to describe the heat transfer in solids with micro-structures, and experimental evidence supports the lagging behaviour in heat transport under various circumstances, including the high-order effect of phase legs in the delayed response.
Book
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
TL;DR: This paper presents a meta-modelling framework for estimating the value of materials and manufacturing components in the construction industry and some of the factors that contribute to their quality and reliability.
Journal ArticleDOI
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
TL;DR: In this article, a thin interlayer of pure Sn foil has been sandwiched between two pieces of Cu foil base metal and reflowed at 260, 300 and 340°C, under 2%H 2 /98%N 2 forming gas, for 5-480min.
Journal ArticleDOI
Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems
S. Bader,Wolfgang Gust,H. Hieber +2 more
TL;DR: In this article, the growth of the intermetallic compounds of the Cu and Ni systems were studied in thin films at temperatures from 513 to 673 K. The results showed that the Ni3Sn phase does not nucleate below 623 K in specimens with clean Ni/Sn interfaces, and the influence of the small grain size of the Ni thin films were studied by performing similar experiments with Cu or Ni single crystals.
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