Journal ArticleDOI
Liquid immersion cooling of small electronic devices
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TLDR
In this paper, the authors examined liquid immersion techniques for cooling minute heat sources and found that nucleate boiling may introduce mechanical stresses, contamination and physical design problems, and two alternatives to boiling (forced convection and bubble induced mixing) were also investigated which reduced or bypassed some of these problems.About:
This article is published in Microelectronics Reliability.The article was published on 1973-04-01. It has received 47 citations till now. The article focuses on the topics: Nucleate boiling & Convective heat transfer.read more
Citations
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Conjugate natural convection cooling of protruding heat sources mounted on a substrate placed inside an enclosure: a parametric study
P.N. Madhavan,V.M.K. Sastri +1 more
TL;DR: In this paper, a parametric study for a conjugate natural convection cooled substrate mounted heat sources placed inside an enclosure is presented, where the governing coupled non-dimensional transport equations were solved using the finite volume technique.
Journal ArticleDOI
Direct liquid cooling of electronic chips by single-phase forced convection of fc-72
TL;DR: In this paper, a single-phase heat transfer with the working fluid FC-72 from a single chip and a four-in-line chip module mounted on one wall of a vertical rectangular channel is carried out.
Journal ArticleDOI
Bibliography of Heat Transfer in Electronic Equipment
V. Antonetti,R. Simons +1 more
TL;DR: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented in this paper, covering the period from 1970-1984, although a majority of the papers listed were published in the last three years.
Journal ArticleDOI
High-efficiency cooling via the monolithic integration of copper on electronic devices
T. Gebrael,Jiaqi Li,A. Gamboa,Jingcheng Ma,Joseph Schaadt,Logan Horowitz,Robert C. N. Pilawa-Podgurski,Nenad Miljkovic +7 more
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Numerical modelling of turbulent heat transfer from discrete heat sources in a liquid-cooled channel
TL;DR: In this paper, the effects of the ratio of the channel height to the length of heat source and orientation on the heat transfer characteristics inside a liquid-cooled rectangular channel are investigated.
References
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Journal ArticleDOI
A hydrodynamic model for nucleate pool boiling
TL;DR: In this paper, a hydrodynamic model of stagnation flow is proposed for saturated nucleate boiling over a flat surface, and a relation between the heat-transfer coefficient and the thermal boundary-layer thickness induced by rising bubbles is obtained, and good agreement with measured results in the low heat-flux region is indicated.
Journal ArticleDOI
Liquid cooling of microelectronic devices by free and forced convection
TL;DR: In this article, the effect of component size on convective heat transfer from small devices (with surface areas between 2·00 and 0·01 sq cm) was investigated analytically and experimentally.
Journal ArticleDOI
Packaging and cooling problems associated with microelectronics equipment
F. Honnor,M.A. Thomas +1 more
TL;DR: In this paper, the development of new packaging techniques for electronic equipment and assesses the need for new thermal analysis techniques are discussed and thermal problems in future equipment are considered and possible future cooling systems are presented.
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