Low Loss Multi-Layer Wiring for Superconducting Microwave Devices

TLDR: In this paper, the structural benefits of inter-layer dielectrics during fabrication and post-fabrication mitigates the added capacitive loss of these airbridges were demonstrated.

Abstract: Complex integrated circuits require multiple wiring layers. In complementary metal-oxide-semiconductor (CMOS) processing, these layers are robustly separated by amorphous dielectrics. These dielectrics would dominate energy loss in superconducting integrated circuits. Here we demonstrate a procedure that capitalizes on the structural benefits of inter-layer dielectrics during fabrication and mitigates the added loss. We separate and support multiple wiring layers throughout fabrication using SiO$_2$ scaffolding, then remove it post-fabrication. This technique is compatible with foundry level processing and the can be generalized to make many different forms of low-loss multi-layer wiring. We use this technique to create freestanding aluminum vacuum gap crossovers (airbridges). We characterize the added capacitive loss of these airbridges by connecting ground planes over microwave frequency $\lambda/4$ coplanar waveguide resonators and measuring resonator loss. We measure a low power resonator loss of $\sim 3.9 \times 10^{-8}$ per bridge, which is 100 times lower than dielectric supported bridges. We further characterize these airbridges as crossovers, control line jumpers, and as part of a coupling network in gmon and fuxmon qubits. We measure qubit characteristic lifetimes ($T_1$'s) in excess of 30 $\mu$s in gmon devices.