Journal ArticleDOI
Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips
TLDR
In this article, a micro-scale flat plate heat pipe with superhydrophilicity in a specially treated wick was explored and a visual study on the two-phase flow pattern was conducted.About:
This article is published in Energy Conversion and Management.The article was published on 2019-12-01. It has received 62 citations till now. The article focuses on the topics: Heat pipe & Heat spreader.read more
Citations
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Journal ArticleDOI
A new cooling strategy for edge computing servers using compact looped heat pipe
TL;DR: Wang et al. as mentioned in this paper proposed a new cooling concept enabled by a compact loop heat pipe module, which can provide high reliability operation, meanwhile maintaining high thermal performance, and demonstrated that the 4-mm thick loop heatpipe module with finned tube condenser could dissipate a heat load of 150-W under a wide fan voltage range from 12-V to 24-V at tested directions when the chip junction temperature was below 85°C.
Journal ArticleDOI
Micro-Channel Heat Sink: A Review
TL;DR: In this article, the heat transfer correlations of single-phase, two-phase and nanofluid in a micro-channel are discussed and analyzed, and the correlations of pressure drop for single phase and two phase fluids are also presented.
Journal ArticleDOI
A review of heat pipe technology for foldable electronic devices
TL;DR: This research presents a comprehensive review of the state-of-the-art for both rigid and flexible ultra-thin heat pipe technology for flexible thermal management solutions for foldable and wearable devices.
Journal ArticleDOI
A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
Saad Ali,Faiz Ahmad,Puteri Sri Melor Megat Yusoff,Norhamidi Muhamad,Eugenio Oñate,Muhammad Rafi Raza,Khurshid Malik +6 more
TL;DR: In this article, an overview of factors affecting thermal conductivity of composite namely defect processing route, density, graphene derivative, lateral size, concentration, alignment, graphene/matrix interfacial bonding and graphene modification are discussed.
Journal ArticleDOI
Significant factors affecting heat transfer performance of vapor chamber and strategies to promote it: A critical review
TL;DR: This paper systematically reviews the global research on VC to provide the current development status and a certain reference for future design and the commonly-used strategies to enhance the heat transfer performance are summarized.
References
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Journal ArticleDOI
Wetting transparency of graphene
J. Rafiee,Xi Mi,Hemtej Gullapalli,Abhay V. Thomas,Fazel Yavari,Yunfeng Shi,Pulickel M. Ajayan,Nikhil Koratkar +7 more
TL;DR: It is reported that graphene coatings do not significantly disrupt the intrinsic wetting behaviour of surfaces for which surface-water interactions are dominated by van der Waals forces, and contact angle measurements indicate that a graphene monolayer is wetting-transparent to copper, gold or silicon, but not glass, for which the wettability is dominated by short-range chemical bonding.
Book
Heat Pipes: Theory, Design and Applications
David Reay,R.J. McGlen,P.A. Kew +2 more
TL;DR: The Heat Pipes 6th Edition as discussed by the authors is an essential guide for practicing engineers and an ideal text for postgraduate students, taking a highly practical approach to the design and selection of heat pipes.
Journal ArticleDOI
Nanostructured copper interfaces for enhanced boiling.
TL;DR: It appears that the ability of the Cu surface with nanorods to generate stable nucleation of bubbles at low superheated temperatures results from a synergistic coupling effect between the nanoscale gas cavities formed within the nanorod interstices and micrometer-scale defects that form on the film surface during Nanorod deposition.
Journal ArticleDOI
Nanoengineered materials for liquid–vapour phase-change heat transfer
TL;DR: In this article, the authors present an overview of the surface, thermal and material science to illustrate how new materials and designs can improve boiling and condensation, and focus on nanoengineered materials, with emphasis on further improving the heat-transfer performance and long-term robustness.
Journal ArticleDOI
Review of applications and developments of ultra-thin micro heat pipes for electronic cooling
TL;DR: In this article, a comprehensive review of the recent developments and applications of ultra-thin micro heat pipe (UTHP) for thermal management of electronics is presented, and the challenges affecting the development and application of UTHPs are outlined, and recommendations for future research are presented.