Journal ArticleDOI
Micromachined ultrasound transducers with improved coupling factors from a CMOS compatible process
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TLDR
The BiCMOS process has been modified to meet the demands for ultrasound generation and reception, and the electromechanical coupling is now almost comparable with that for piezoelectric transducers.About:
This article is published in Ultrasonics.The article was published on 2000-03-01. It has received 121 citations till now. The article focuses on the topics: Capacitive micromachined ultrasonic transducers & Ultrasonic sensor.read more
Citations
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Journal ArticleDOI
Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology
TL;DR: In this paper, a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding technique is introduced. But the method is not suitable for large CMUTs.
Journal ArticleDOI
Development of piezoelectric micromachined ultrasonic transducers
TL;DR: In this article, a finite element (FE) model was developed to design and optimize pMUTs for the operating range of 2-10 MHz in water and having maximized energy coupling coefficient.
Journal ArticleDOI
Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging
Ira O. Wygant,Xuefeng Zhuang,David T. Yeh,Omer Oralkan,Arif Sanli Ergun,Mustafa Karaman,Butrus T. Khuri-Yakub +6 more
TL;DR: Combining the transducers array and IC allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.
Journal ArticleDOI
Piezoelectric Micromachined Ultrasound Transducer (PMUT) Arrays for Integrated Sensing, Actuation and Imaging
Yongqiang Qiu,James Gigliotti,Margeaux Wallace,Flavio Griggio,Christine E. M. Demore,Sandy Cochran,Susan Trolier-McKinstry +6 more
TL;DR: An overview of the current development status of piezoelectric micromachined ultrasound transducers and a discussion of their suitability for miniaturized and integrated devices are presented.
Journal ArticleDOI
Review of air-coupled ultrasonic materials characterization.
TL;DR: Developments in air-coupled transduction and electronics are briefly treated, although the emphasis here is on methods of characterization and inspection, and in overcoming limitations inherent in the use of such a tenuous sound coupling medium as air.
References
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Waves in fluids
TL;DR: One-dimensional waves in fluids as discussed by the authors were used to describe sound waves and water waves in the literature, as well as the internal wave and the water wave in fluids, and they can be classified into three classes: sound wave, water wave, and internal wave.
Journal ArticleDOI
Piezoelectric actuation of PZT thin-film diaphragms at static and resonant conditions
TL;DR: In this paper, the piezoelectric response of silicon diaphragms covered with sputter-deposited PbZr0.45Ti0.55O3 (PZT) films has been investigated in view of their application in ultrasonic micro-actuators.
Proceedings ArticleDOI
A surface micromachined electrostatic ultrasonic air transducer
TL;DR: In this article, the authors describe a technique to fabricate an electrostatic transducer using silicon surface micromachining, which is used to make efficient and broadband ultrasonic air transducers.
Proceedings ArticleDOI
Micromachined transducers for ultrasound applications
TL;DR: In this article, the authors describe the internal structure of a micromechanical transducer element and its acoustical properties, and an outlook for potential applications of micromachined transducers, especially in array configurations, is given.