scispace - formally typeset
Proceedings ArticleDOI

Mitigating Thermal Effects on Clock Skew with Dynamically Adaptive Drivers

TLDR
An adaptive circuit technique is presented that senses the temperature of different parts of the clock tree and adjusts the driving strengths of the corresponding clock buffers dynamically to reduce the clock skew, leading to much improved clock synchronization and design performance.
Abstract
On-chip temperature gradient emerged as a major design concern for high performance integrated circuits for the current and future technology nodes. Clock skew is an undesirable phenomenon for synchronous digital circuits that is exacerbated by the temperature difference between various parts of the clock tree. We investigate the effect of on-chip temperature gradient on the clock skew for a number of temperature profiles. As an effective way of mitigating the clock skew, we present an adaptive circuit technique that senses the temperature of different parts of the clock tree and adjusts the driving strengths of the corresponding clock buffers dynamically to reduce the clock skew. Simulation results demonstrate that with minimal area overhead our adaptive technique is capable of reducing the skew by 72.4%, on the average, leading to much improved clock synchronization and design performance

read more

Citations
More filters
Proceedings ArticleDOI

Thermally robust clocking schemes for 3D integrated circuits

TL;DR: This work proposes a thermally adaptive 3D clocking scheme that dynamically adjusts the driving strengths of the clock buffers to reduce the clock skew between terminals, leading to much improved clock synchronization and design performance in the 3D realm.
Proceedings ArticleDOI

Adaptive clock distribution for 3D integrated circuits

TL;DR: A robust tunable-delay-buffer circuit and a novel active de-skew method are developed in order to handle the cross-die variations, thermal gradients, and wiring asymmetry in 3D ICs.
Journal ArticleDOI

Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits

TL;DR: A novel active deskew technique to adaptively mitigate the cross-tier variations and the 3-D wiring asymmetry is proposed and a thermal profile-based optimization flow is developed to further improve the power efficiency and reduce design overhead.
References
More filters
Book

Digital integrated circuits: a design perspective

Jan M. Rabaey
TL;DR: In this paper, the authors present a survey of the state-of-the-art in the field of digital integrated circuits, focusing on the following: 1. A Historical Perspective. 2. A CIRCUIT PERSPECTIVE.
Proceedings ArticleDOI

Parameter variations and impact on circuits and microarchitecture

TL;DR: Process, voltage and temperature variations; and their impact on circuit and microarchitecture; and possible solutions to reduce the impact of parameter variations and to achieve higher frequency bins are presented.
Journal ArticleDOI

Inductance calculations in a complex integrated circuit environment

TL;DR: In this paper, a method for calculating multiloop inductances formed by complicated interconnection conductors is described, where the conductor loops are divided into segments for which so-called partial inductances are calculated.
Journal ArticleDOI

FASTHENRY: a multipole-accelerated 3-D inductance extraction program

TL;DR: Results from examples are given to demonstrate that the multipole acceleration can reduce required computation time and memory by more than an order of magnitude for realistic integrated circuit packaging problems.
Journal ArticleDOI

FastCap: a multipole accelerated 3-D capacitance extraction program

TL;DR: Performance comparisons on integrated circuit bus crossing problems show that for problems with as few as 12 conductors the multipole accelerated boundary element method can be nearly 500 times faster than Gaussian-elimination-based algorithms, and five to ten times slower than the iterative method alone, depending on required accuracy.
Related Papers (5)