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Open foundry platform for high-performance electronic-photonic integration

TLDR
This paper presents photonic devices with 3 dB/cm waveguide loss fabricated in an existing commercial electronic 45 nm SOI-CMOS foundry process and demonstrates an 8-channel optical microring-resonator filter bank and optical modulators, both controlled by integrated digital circuits.
Abstract
This paper presents photonic devices with 3 dB/cm waveguide loss fabricated in an existing commercial electronic 45 nm SOI-CMOS foundry process. By utilizing existing front-end fabrication processes the photonic devices are monolithically integrated with electronics in the same physical device layer as transistors achieving 4 ps logic stage delay, without degradation in transistor performance. We demonstrate an 8-channel optical microring-resonator filter bank and optical modulators, both controlled by integrated digital circuits. By developing a device design methodology that requires zero process infrastructure changes, a widely available platform for high-performance photonic-electronic integrated circuits is enabled.

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Journal ArticleDOI

Integrated microwave photonics

TL;DR: This article reviews the recent advances in this emerging field which is dubbed as integrated microwave photonics and key integrated MWP technologies are reviewed and the prospective of the field is discussed.
Journal ArticleDOI

Neuromorphic photonic networks using silicon photonic weight banks.

TL;DR: First observations of a recurrent silicon photonic neural network, in which connections are configured by microring weight banks are reported, and a mathematical isomorphism between the silicon photonics circuit and a continuous neural network model is demonstrated through dynamical bifurcation analysis.
Journal ArticleDOI

Attojoule Optoelectronics for Low-Energy Information Processing and Communications

TL;DR: This work shows that the next major interconnect dissipations are in the electronic circuits for receiver amplifiers, timing recovery, and multiplexing, and it can address these through the integration of photodetectors to reduce or eliminate receiver circuit energies, free-space optics to eliminate the need for timing andmultiplexing circuits, and using optics generally to save power by running large synchronous systems.
Journal ArticleDOI

Review of Silicon Photonics Foundry Efforts

TL;DR: In this paper, a fabless foundry model using standardized process technology platforms is discussed, and key results from an on-going effort to set-up a manufacturing silicon photonics foundry line are presented.
References
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Journal ArticleDOI

Micrometre-scale silicon electro-optic modulator

TL;DR: Electro-optic modulators are one of the most critical components in optoelectronic integration, and decreasing their size may enable novel chip architectures, and here a high-speed electro-optical modulator in compact silicon structures is experimentally demonstrated.
Journal ArticleDOI

Device Requirements for Optical Interconnects to Silicon Chips

TL;DR: The current performance and future demands of interconnects to and on silicon chips are examined and the requirements for optoelectronic and optical devices are project if optics is to solve the major problems of interConnects for future high-performance silicon chips.
Journal ArticleDOI

Ultracompact optical buffers on a silicon chip

TL;DR: In this paper, the trade-offs between resonantly enhanced group delay, device size, insertion loss and operational bandwidth are analyzed for various delay-line designs, and a large fractional group delay exceeding 10 bits is achieved for bit rates as high as 20 Gbps.
Journal ArticleDOI

12.5 Gbit/s carrier-injection-based silicon micro-ring silicon modulators

TL;DR: A scheme for achieving high-speed operation for carrier-injection based silicon electro-optical modulator, which is optimized for small size and high modulation depth is shown.
Journal ArticleDOI

CMOS Photonics for High-Speed Interconnects

Cary Gunn
- 01 Mar 2006 - 
TL;DR: Luxtera has demonstrated the technology required to implement CMOS photonics, and product development is underway as discussed by the authors for 10-Gbps operation, in addition to that required to scale to 100 Gbps and 1 Tbps.
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