Journal ArticleDOI
Parylene to silicon nitride bonding for post-integration of high pressure microfluidics to CMOS devices
TLDR
In this paper, a low temperature (280 °C) Parylene-C wafer bonding technique was proposed to realize high pressure microfluidics-to-CMOS integration.Abstract:
High pressure-rated channels allow microfluidic assays to be performed on a smaller footprint while keeping the throughput, thanks to the higher enabled flow rates, opening up perspectives for cost-effective integration of CMOS chips to microfluidic circuits. Accordingly, this study introduces an easy, low-cost and efficient method for realizing high pressure microfluidics-to-CMOS integration. First, we report a new low temperature (280 °C) Parylene-C wafer bonding technique, where O2 plasma-treated Parylene-C bonds directly to Si3N4 with an average bonding strength of 23 MPa. The technique works for silicon wafers with a nitride surface and uses a single layer of Parylene-C deposited only on one wafer, and allows microfluidic structures to be easily formed by directly bonding to the nitride passivation layer of the CMOS devices. Exploiting this technology, we demonstrated a microfluidic chip burst pressure as high as 16 MPa, while metal electrode structures on the silicon wafer remained functional after bonding.read more
Citations
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Journal ArticleDOI
Lab-on-a-chip devices
TL;DR: This review provides easy-to-understand examples and targets the microtechnology/engineering community as well as researchers in the life sciences, and discusses both research and commercial activities.
Journal ArticleDOI
Lab-on-CMOS integration of microfluidics and electrochemical sensors.
Yue Huang,Andrew J. Mason +1 more
TL;DR: A CMOS-microfluidics integration scheme for electrochemical microsystems capable of high packing density, is suitable for wafer-level batch production, and opens new opportunities to combine the performance benefits of on-CMOS sensors with lab-on-chip platforms is introduced.
Journal ArticleDOI
High Throughput-Per-Footprint Inertial Focusing
TL;DR: Inertial particle focusing is demonstrated with a TPFP up to 0.3 L/(min cm²) in high aspect-ratio rectangular microfluidic channels that are readily fabricated with a post-CMOS integratable process, suggesting at least a 100-fold improvement compared to previously demonstrated techniques.
Journal ArticleDOI
Microfluidic processor allows rapid HER2 immunohistochemistry of breast carcinomas and significantly reduces ambiguous (2+) read-outs
TL;DR: A microfluidic tissue processor that permits accurate quantification of the expression of biomarkers on tissue sections, enabled by the ultra-rapid and uniform fluidic exchange of the device.
Journal ArticleDOI
Integration of microelectronic chips in microfluidic systems on printed circuit board
TL;DR: In this paper, a new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented, based on a packaging technique that yields a large and flat area with small and shallow (~44 µm deep) openings over the chips.
References
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Journal ArticleDOI
Determining the optimal PDMS–PDMS bonding technique for microfluidic devices
TL;DR: In this article, a comparative study of four rapid, inexpensive alternative polydimethysiloxane (PDMS) bonding approaches was undertaken to determine relative bond strength, including corona discharge, partial curing, cross-linker variation and uncured PDMS adhesive.
Journal ArticleDOI
Rapid prototyping polymers for microfluidic devices and high pressure injections
TL;DR: These polymer alternatives to PDMS, TPE, PUMA and NOA, have some considerable strengths for rapid prototyping when bond strength, predictable operation at high pressure, or transitioning to commercialization are considered important for the application.
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Flexible polyimide probes with microelectrodes and embedded microfluidic channels for simultaneous drug delivery and multi-channel monitoring of bioelectric activity.
TL;DR: The development and characterisation of implantable polyimide microprobes that allow simultaneous, selective chemical delivery/probing and multi-channel recording/stimulation of bioelectric activity are reported on.
Journal ArticleDOI
Integrated cell manipulation system--CMOS/microfluidic hybrid.
TL;DR: Combining microelectronics and microfluidics, the CMOS/microfluidic hybrid system presents a new model for a cell manipulation platform in biological and biomedical applications.
Journal ArticleDOI
A low-temperature wafer bonding technique using patternable materials
TL;DR: In this article, photo-definable material with patternable characteristics served as the bonding layer between the silicon wafers, and the results indicated that SU-8 is the best material with a bonding strength of up to 213 kg cm−2 (20.6 MPa).
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