Journal ArticleDOI
Sintering of Copper Particles for Die Attach
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TLDR
In this paper, a feasibility analysis of sintering of copper particles for die attach is presented, where porosity, Young's modulus as well as electrical and thermal conductivities of sintered layers are analyzed.Abstract:
First steps are taken toward a low-cost alternative to silver sintering as a highly reliable die attach technology for deep drilling applications and future power electronic modules. In this feasibility analysis, we evaluate sintering of copper particles for die attach. Particulate copper pastes are pretreated in H2 atmosphere (50 mbar) in order to gain oxide-free particles. Subsequently, particles are sintered at a pressure of 40 N/mm2 and a temperature of 350°C for 2 min. Porosity, Young's modulus as well as electrical and thermal conductivities of sintered layers are analyzed. Moreover, shear tests at ambient temperature are performed for evaluating the adhesion of monometallic as well as Cu-Au bonds according to the American military standard for chip-substrate contacts (MIL-STD-883H, method 2019.8).read more
Citations
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Optical, Photoluminescence, and Vibrational Spectroscopy of Metal Nanoparticles
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Journal ArticleDOI
Development of Micron-Sized Cu–Ag Composite Paste for Oxidation-Free Bare Cu Bonding in Air Condition and its Deterioration Mechanism During Aging and Power Cycling Tests
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DissertationDOI
Mesoscale microstructure evolution, reliability and failure analysis of high temperature transient liquid phase sintering joints
TL;DR: In this paper, phase field modeling of the microstructure of TLPS materials fabricated by different processing methods will be conducted, and efforts will also be conducted to identify failure modes and mechanisms experimentally under dynamic, power and thermal cycling loads as a function of critical microstructural features.
References
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Semiconductor Material and Device Characterization, 3rd Edition
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Novel large area joining technique for improved power device performance
H. Schwarzbauer,R. Kuhnert +1 more
TL;DR: In this paper, a diffusion welding-based low-temperature joining technique based on the principle of diffusion welding has been developed for joining a silicon wafer to suitable substrates.
Journal ArticleDOI
Electroless silver coating on fine copper powder and its effects on oxidation resistance
TL;DR: In this article, the effect of electroless silver coating on fine copper powder (3.4 μm) and its effects on oxidation resistance were investigated by varying the silver contents.
Journal ArticleDOI
High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment
TL;DR: In this article, a low-temperature sintering of nanoscale silver paste was used to achieve high temperature operation of SiC power semiconductor devices by using stencil-printed layers of the nano-scale silver paste on Au or Ag metallized direct bonded copper (DBC) substrates for die-attachment.