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Journal ArticleDOI

State of the Art of High Heat Flux Cooling Technologies

Bruno Agostini, +5 more
- 06 Mar 2007 - 
- Vol. 28, Iss: 4, pp 258-281
TLDR
In this paper, a literature review is presented to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips.
Abstract: 
The purpose of this literature review is to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips. Today, most development efforts are focused on three technologies: liquid cooling in copper or silicon micro-geometry heat dissipation elements, impingement of liquid jets directly on the silicon surface of the chip, and two-phase flow boiling in copper heat dissipation elements or plates with numerous microchannels. The principal challenge is to dissipate the high heat fluxes (current objective is 300 W/cm2) while maintaining the chip temperature below the targeted temperature of 85°C, while of second importance is how to predict the heat transfer coefficients and pressure drops of the cooling process. In this study, the state of the art of these three technologies from recent experimental articles (since 2003) is analyzed and a comparison of the respective merits and ...

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Citations
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Journal ArticleDOI

The ALICE Collaboration

K. Aamodt, +992 more
- 01 Nov 2009 - 
TL;DR: In this paper, the production of mesons containing strange quarks (KS, φ) and both singly and doubly strange baryons (,, and − + +) are measured at mid-rapidity in pp collisions at √ s = 0.9 TeV with the ALICE experiment at the LHC.
Journal ArticleDOI

A critical review of traditional and emerging techniques and fluids for electronics cooling

S. M. Sohel Murshed, +1 more
- 01 Oct 2017 - 
TL;DR: In this paper, a critical review of traditional and emerging cooling methods as well as coolants for electronics is provided, summarizing traditional coolants, heat transfer properties and performances of potential new coolants such as nanofluids are also reviewed and analyzed.
Journal ArticleDOI

Co-designing electronics with microfluidics for more sustainable cooling.

Remco van Erp, +4 more
- 09 Sep 2020 - 
TL;DR: By removing the need for large external heat sinks, this approach should enable the realization of very compact power converters integrated on a single chip, potentially extending Moore's law and greatly reducing the energy consumption in cooling of electronics.
Journal ArticleDOI

Towards hybrid nanofluids: Preparation, thermophysical properties, applications, and challenges

Hamza Babar, +1 more
- 01 May 2019 - 
TL;DR: In this paper, the authors seek the attention of young scholars and experts working in the field of heat transfer by discussing the applications and challenges of hybrid nanofluids with a concise discussion on its history, synthesis techniques, thermophysical properties, research gaps, future directions, current status, and the leading groups, organizations and countries around the world.
Journal ArticleDOI

History, Advances, and Challenges in Liquid Flow and Flow Boiling Heat Transfer in Microchannels: A Critical Review

Satish G. Kandlikar
- 01 Mar 2012 - 
TL;DR: In this paper, the authors provide a historical perspective of the progress made in understanding the underlying mechanisms in single-phase liquid flow and two-phase flow boiling processes and their use in high heat flux removal applications.
References
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Journal ArticleDOI

High-performance heat sinking for VLSI

David B. Tuckerman, +1 more
- 01 May 1981 - 
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Book ChapterDOI

Heat and Mass Transfer between Impinging Gas Jets and Solid Surfaces

Holger Martin
- 01 Jan 1977 - 
TL;DR: In this article, the authors present a comprehensive survey emphasizing the engineering applications and empirical equations, presented for the prediction of heat and mass transfer coefficients within a large and technologically important range of variables.
Journal ArticleDOI

A simple friction pressure drop correlation for two-phase flow in pipes

H. Müller-Steinhagen, +1 more
- 01 Nov 1986 - 
TL;DR: In this article, a new correlation for the prediction of frictional pressure drop for two-phase flow in pipes is suggested which is simple and more convenient to use than other methods.
Journal ArticleDOI

Spray cooling heat transfer: The state of the art

Jungho Kim
- 01 Aug 2007 - 
TL;DR: In this article, the authors provide an introduction to spray cooling for electronic cooling applications, review some proposed spray cooling heat transfer mechanisms, and summarizes the data regarding the effects of non-condensable gas, surface enhancement, spray inclination, and gravity.
Journal ArticleDOI

Metal foams as compact high performance heat exchangers

Kevin Boomsma, +2 more
- 01 Dec 2003 - 
TL;DR: In this paper, open-cell metal foams with an average cell diameter of 2.3 mm were manufactured from 6101-T6 aluminum alloy and were compressed and fashioned into compact heat exchangers.
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