Showing papers on "Substrate (printing) published in 2009"

Light-emitting device and method of manufacturing the same

Abstract: Provided is a light emitting diode (LED) manufactured by using a wafer bonding method and a method of manufacturing a LED by using a wafer bonding method. The wafer bonding method may include interposing a stress relaxation layer (33) formed of a metal between a semiconductor layer (20) and a bonding substrate (31). When the stress relaxation layer is used, stress between the bonding substrate and a growth substrate may be offset due to the flexibility of metal, and accordingly, bending or warpage of the bonding substrate may be reduced or prevented.

Electrical connector system.

Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Polymer pen lithography

Abstract: The disclosure relates to methods of printing indicia on a substrate using a tip array comprised of elastomeric, compressible polymers. The tip array can be prepared using conventional photolithographic methods and can be tailored to have any desired number and/or arrangement of tips. Numerous copies (e.g., greater than 15,000, or greater than 11 million) of a pattern can be made in a parallel fashion in as little as 40 minutes.

Microcontact Printing: Limitations and Achievements

Abstract: Microcontact printing (µCP) offers a simple and low-cost surface patterning methodology with high versatility and sub-micrometer accuracy. The process has undergone a spectacular evolution since its invention, improving its capability to form sub-100 nm SAM patterns of various polar and apolar materials and biomolecules over macroscopic areas. Diverse development lines of µCP are discussed in this work detailing various printing strategies. New printing schemes with improved stamp materials render µCP a reproducible surface-patterning technique with an increased pattern resolution. New stamp materials and PDMS surface-treatment methods allow the use of polar molecules as inks. Flat elastomeric surfaces and low-diffusive inks push the feature sizes to the nanometer range. Chemical and supramolecular interactions between the ink and the substrate increase the applicability of the µCP process.

Organic light emitting display device

Abstract: PROBLEM TO BE SOLVED: To provide an organic light emitting display device for providing a touch panel function without increasing thickness of the display device SOLUTION: The organic light emitting display device includes: a substrate; a display unit on the substrate; an encapsulation substrate having a side facing the substrate; a touch unit facing the display unit and including a plurality of first sensors electrically coupled with each other and extending in parallel rows along a first direction, and a plurality of second sensors electrically coupled with each other and extending in parallel columns along a second direction crossing the first direction; and an insulation layer on at least a portion of the first sensors and second sensors COPYRIGHT: (C)2010,JPO&INPIT

Spraying asymmetry into functional membranes layer-by-layer.

Abstract: A process based on spray-assisted layer-by-layer deposition produces conformal coatings on individual fibres within the bulk porous substrate. Additional processing creates a sublayer with properties that differ from the substrate. The method is used to fabricate a material that acts as both a toxin barrier and a photocatalyst.

Capacitive touch panel

Abstract: A capacitive touch panel includes a substrate having a pattern-forming surface, a color pixel layer formed on the substrate, and a patterned conductive layer formed on the pattern-forming surface of the substrate. The patterned conductive layer includes a plurality of first electrode units, a plurality of second electrode units, a plurality of spaced apart first conductive lines, and a plurality of spaced apart second conductive lines. The first electrode units are capacitively coupled to the second electrode units so as to form a plurality of two dimensionally arranged capacitive sensing units. Each of the first electrode units includes a plurality of first electrodes. Each of the first conductive lines is connected to and extends along the pattern-forming surface from at least one of the first electrodes of a respective one of the first electrode units into a bonding area of the pattern-forming surface. The second conductive lines extend respectively from the second electrode units into the bonding area, and do not cross the first conductive lines.

Transparent electronics based on transfer printed carbon nanotubes on rigid and flexible substrates

Abstract: Methods and devices for transparent electronics are disclosed. According to an embodiment, transparent electronics are provided based on transfer printed carbon nanotubes that can be disposed on both rigid and flexible substrates. Methods are provided to enable highly aligned single-walled carbon nanotubes (SWNTs) to be used in transparent electronics for achieving high carrier mobility while using low-temperature processing. According to one method, highly aligned nanotubes can be grown on a first substrate. Then, the aligned nanotubes can be transferred to a rigid or flexible substrate having pre-patterned gate electrodes. Source and drain electrodes can be formed on the transferred nanotubes. The subject devices can be integrated to provide logic gates and analog circuitry for a variety of applications.

Substrate processing method

Abstract: The present invention provides a substrate processing method to process a substrate including at least a process layer, an intermediate layer, and a mask layer are stacked in this order. The mask layer includes an aperture configured to expose a portion of the intermediate layer. The substrate processing method includes a material deposition step of depositing a material on a side surface of the aperture and exposing a portion of the process layer by etching the exposed portion of the intermediate layer by plasma generated from a deposit gas, and an etching step of etching the exposed portion of the process layer.

Substrate processing apparatus

Abstract: A method of using a heat exchanger efficiently and uniformly to cool or heats portions to be controlled to a prescribed temperature, and then continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.

Plasma atomic layer deposition system and method

Abstract: An improved gas deposition chamber includes a hollow gas deposition volume formed with a volume expanding top portion and a substantially constant volume cylindrical middle portion. The hollow gas deposition volume may include a volume reducing lower portion. An aerodynamically shaped substrate support chuck is disposed inside gas deposition chamber with a substrate support surface positioned in the constant volume cylindrical middle portion. The volume expanding top portion reduces gas flow velocity between gas input ports and the substrate support surface. The aerodynamic shape of the substrate support chuck reduces drag and helps to promote laminar flow over the substrate support surface. The volume reducing lower portion helps to increase gas flow velocity after the gas has past the substrate support surface. The improved gas deposition chamber is configurable to 200 mm diameter semiconductor wafers using ALD and or PALD coating cycles. An improved coating method includes expanding process gases inside the deposition chamber prior to the process gas reaching surfaces of a substrate being coated. The method further includes compressing the process gases inside the deposition chamber after the process gas has flowed past surfaces of the substrate being coated.

Nonvolatile semiconductor memory device and method of manufacturing the same

Abstract: A nonvolatile semiconductor memory device comprises a memory string, and a wiring. The memory string comprises a semiconductor layer, a charge storage layer, and a plurality of first conductive layers. The plurality of first conductive layers comprises a stepped portion formed in a stepped shape such that positions of ends of the plurality of first conductive layers differ from one another. The wiring comprises a plurality of second conductive layers extending upwardly from an upper surface of the first conductive layers comprising the stepped portion. The plurality of second conductive layers are formed such that upper ends thereof are aligned with a surface parallel to the substrate, and such that a diameter thereof decreases from the upper end thereof to a lower end thereof. The plurality of second conductive layers are formed such that the greater a length thereof in the perpendicular direction, the larger a diameter of the upper end thereof.

Integration of light emitting devices and printed electronics into vehicle trim components

Abstract: A relatively thin printed LED backlight device with an integral diffuser may be integrated into an interior trim component using a molding process, such as injection molding, compression molding and reaction injection molding. The display portion may be placed behind a textile surface or molded grille or may form a portion of the outer surface of the trim component to provide light to low light areas of the vehicle. Electronic circuitry and components may be printed on to the substrate of the device as part of an in-line continuous process at the molding station to allow low inventory and customization of each backlight device.

One-step inkjet printing of conductive silver tracks on polymer substrates.

Abstract: A one-step process to fabricate conductive features on flexible polymer substrates by inkjet printing an organometallic silver ink directly onto a substrate that is heated to 130 °C is presented. This process led to the immediate sintering of the printed features. The samples were left for 5 min at elevated temperature, which resulted in conductive silver features with a resistivity of eight times the bulk silver value. The combination of this ink and the simultaneous printing/sintering process opens up routes for the direct fabrication of conductive features on common polymer substrates that could be applied, for example, in roll-to-roll production of flexible microelectronic systems.

Boron nitride and boron nitride-derived materials deposition method

Abstract: A method and apparatus are provided to form spacer materials adjacent substrate structures. In one embodiment, a method is provided for processing a substrate including placing a substrate having a substrate structure adjacent a substrate surface in a deposition chamber, depositing a spacer layer on the substrate structure and substrate surface, and etching the spacer layer to expose the substrate structure and a portion of the substrate surface, wherein the spacer layer is disposed adjacent the substrate structure. The spacer layer may comprise a boron nitride material. The spacer layer may comprise a base spacer layer and a liner layer, and the spacer layer may be etched in a two-step etching process.

Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system

Abstract: A substrate holder for supporting a substrate in a processing system includes a temperature controlled support base having a first temperature, and a substrate support opposing the temperature controlled support base and configured to support the substrate. Also included is one or more heating elements coupled to the substrate support and configured to heat the substrate support to a second temperature above the first temperature, and a thermal insulator disposed between the temperature controlled support base and the substrate support. The thermal insulator includes a non-uniform spatial variation of the heat transfer coefficient (W/m2-K) through the thermal insulator between the temperature controlled support base and the substrate support.

Substrate position detection apparatus, substrate position detection method, film deposition apparatus, film deposition method, and a computer readable storage medium

Abstract: A disclosed substrate position detection apparatus includes an imaging portion configured to take an image of a substrate subject to a position detection; a panel member provided between the imaging portion and the substrate and including a first opening that ensures a field of view for the imaging portion with respect to the substrate, the panel member having a light scattering property; a first illuminating portion configured to illuminate the panel member; and a processing portion capable of determining a position of the substrate in accordance with the image taken through the first opening by the imaging portion.

Large-area single- and few-layer graphene on arbitrary substrates

Abstract: A film of single-layer to few-layer graphene is formed by depositing a graphene film via chemical vapor deposition on a surface of a growth substrate. The surface on which the graphene is deposited can be a polycrystalline nickel film, which is deposited by evaporation on a SiO 2 /Si substrate. A protective support layer is then coated on the graphene film to provide support for the graphene film and to maintain its integrity when it is removed from the growth substrate. The surface of the growth substrate is then etched to release the graphene film and the protective support layer from the growth substrate, wherein the protective support layer maintains the integrity of the graphene film during and after its release from the growth substrate. After being released from the growth substrate, the graphene film and protective support layer can be applied onto an arbitrary target substrate for evaluation or use in any of a wide variety of applications.

Inkjet printing of light emitting quantum dots

Abstract: We demonstrate the fabrication of diodes having inkjet printed light emitting quantum dots layer Close packing of printed layer is shown to be influenced by surface morphology of the underlying polymer layer and size variance of quantum dots used We extend our approach to printing quantum dots onto a quarter video graphics array substrate (76 800 monochrome pixels) The purity of emitted electroluminescent spectra of resulting devices is related to coverage integrity of printed layer, which in turn is shown to be affected by the number of printed drops per pixel

Patterning conductive PDMS nanocomposite in an elastomer using microcontact printing

Abstract: This paper introduces a simple method of embedding conductive and flexible elastomer micropatterns into a bulk elastomer. Employing microcontact printing and cast molding techniques, patterns consisting of conductive poly(dimethylsiloxane) (PDMS) composites mixed with multi-walled carbon nanotubes (MWCNTs) are embedded into bulk PDMS to form all-elastomer devices. To pattern conductive composites, a micromachined printing mold is utilized to transfer composite ink from a spin-coated thin layer to another substrate. Distinct from previously reported approaches, the printing mold in this technique, once fabricated, can be repeatedly used to generate new patterns and therefore greatly simplifies the device fabrication process and improves its efficiency. Manufactured devices with embedded conductive patterns exhibit excellent mechanical flexibility. With characterization of printing reliability, electrical conductivity of the composites is also shown with different loading percentages of MWCNTs. Furthermore, a simple strain gauge was fabricated and tested to demonstrate the potential applications of embedded conductive patterns. Overall, this approach demonstrates feasibility to be a simple method to pattern conductive elastomers that work as electrodes or sensing probes in PDMS-based devices. With further development, this technology yields many potential applications in lab-on-a-chip systems.

Polymers in Mucoadhesive Drug-Delivery Systems: A Brief Note

Abstract: Bioadhesion can be defined as the process by which a natural or a synthetic polymer can adhere to a biological substrate. When the biological substrate is a mucosal layer then the phenomena is known as mucoadhesion. The substrate possessing bioadhesive property can help in devising a delivery system capable of delivering a bioactive agent for a prolonged period of time at a specific delivery site. The current review provides a good insight on mucoadhesive polymers, the phenomenon of mucoadhesion and the factors which have the ability to affect the mucoadhesive properties of a polymer.

Film deposition apparatus, substrate processing apparatus, film deposition method, and computer-readable storage medium

Abstract: In a film deposition apparatus which deposits a thin film on a substrate by supplying first and second reactive gases in a vacuum chamber, there are provided a turntable, a first reactive gas supplying portion and a second reactive gas supplying portion which are arranged to extend from circumferential positions of the turntable to a center of rotation of the turntable, a first separation gas supplying portion arranged between the first and second reactive gas supplying portions, a first space having a first height and including the first separation gas supplying portion, a second space having a second height and including the second reactive gas supplying portion, a third space having a height lower than the first height and the second height and including the first separation gas supplying portion, a position detecting unit detecting a rotation position of the turntable, and a detection part arranged at a circumferential portion of the turntable and detected by the position detecting unit

Use of chained implants in solar cells

Abstract: The manufacture of solar cells is simplified and cost reduced through by performing successive ion implants, without an intervening thermal cycle. In addition to reducing process time, the use of chained ion implantations may also improve the performance of the solar cell. In another embodiment, two different species are successively implanted without breaking vacuum. In another embodiment, the substrate is implanted, then flipped such that it can be and implanted on both sides before being annealed. In yet another embodiment, one or more different masks are applied and successive implantations are performed without breaking the vacuum condition, thereby reducing the process time.

Reinforced composite stamp for dry transfer printing of semiconductor elements

Abstract: Provided are reinforced composite stamps, devices and methods of making the reinforced composite stamps disclosed herein. Reinforced composite stamps of certain aspects of the present invention have a composition and architecture optimized for use in printing systems for dry transfer printing of semiconductor structures, and impart excellent control over relative spatial placement accuracy of the semiconductor structures being transferred. In some embodiments, for example, reinforced composite stamps of the present invention allow for precise and repeatable vertical motion of the patterned surface of the printing apparatus with self-leveling of the stamp to the surface of a contacted substrate. Reinforced composite stamps of certain aspect of the present invention achieve a uniform distribution of contact forces between the printing apparatus patterned surface and the top surface of a substrate being contacted by the reinforced composite stamp of the printing apparatus.

Method and apparatus for removing polymer from a substrate

Abstract: A method and an apparatus for removing polymer from a substrate are provided. In one embodiment, an apparatus utilized to remove polymer from a substrate includes a processing chamber having a chamber wall and a chamber lid defining a process volume, a substrate support assembly disposed in the processing chamber, a remote plasma source coupled to the processing chamber through an outlet port formed through the processing chamber, the outlet port having an opening pointing toward an periphery region of a substrate disposed on the substrate support assembly, and a substrate supporting surface of the substrate support assembly that substantially electrically floats the substrate disposed thereon relative to the substrate support assembly.

Apparatus for efficient removal of halogen residues from etched substrates

Abstract: An apparatus for removing volatile residues from a substrate is provided. In one embodiment, an apparatus for removing halogen-containing residues from a substrate includes a chamber suitable for operating maintaining a vacuum therein and a heat module positioned to heat a substrate disposed in the chamber. The apparatus for removing halogen-containing residues from a substrate also includes at least one of A) a temperature controlled pedestal having a projection extending radially therefrom suitable for supporting the temperature control pedestal on a ledge of the chamber body, the projection thermally isolating the base from the chamber body; B) a pair of substrate holders that include two support flanges extending radially inward from an inner edge of an arc-shaped body, each support flange having a substrate support step that includes a sloped landing; or C) a domed window.

Gas supply device

Abstract: A gas supply device disposed opposite to a substrate mounted on a loading board in a processing container and supplying a process gas for processing the substrate comprises a top plate member having a recess formed to spread gradually toward the state in order to constitute a gas diffusion space at a position facing the substrate on the loading board, and a gas supply nozzle projecting into the recess from the top thereof and having a plurality of gas supply holes along the circumferential direction of the recess.

Semiconductor device and manufacturing method thereof

Abstract: A method for manufacturing a semiconductor device includes providing a substrate having at least a gate structure formed thereon, forming LDDs in the substrate respectively at two side of the gate structure and a spacer at sidewalls of the gate structure, forming a source/drain in the substrate at two side of the gate structure, performing ant etching process to form recesses respectively in the source/drain, forming a barrier layer in the recesses; and performing a salicide process.

Producing method of semiconductor device and substrate processing apparatus

Abstract: Disclosed is a producing method of a semiconductor device, comprising: loading a substrate into a reaction furnace; forming a film on the substrate in the reaction furnace; unloading the substrate from the reaction furnace after the film has been formed; and forcibly cooling an interior of the reaction furnace in a state where the substrate does not exist in the reaction furnace after the substrate has been unloaded.