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Avram Bar-Cohen
Researcher at University of Maryland, College Park
Publications - 329
Citations - 8970
Avram Bar-Cohen is an academic researcher from University of Maryland, College Park. The author has contributed to research in topics: Heat transfer & Heat sink. The author has an hindex of 50, co-authored 329 publications receiving 8329 citations. Previous affiliations of Avram Bar-Cohen include Auburn University & DARPA.
Papers
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Thermally optimum spacing of vertical, natural convection cooled, parallel plates
TL;DR: In this article, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.
Journal ArticleDOI
Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates
TL;DR: In this paper, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.
Book
Thermal Analysis and Control of Electronic Equipment
Allan D. Kraus,Avram Bar-Cohen +1 more
TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ
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Direct Liquid Cooling of High Flux Micro and Nano Electronic Components
TL;DR: This paper begins with a discussion of the thermophysics of phase-change processes and a description of the available dielectric liquid cooling techniques and their history, and describes the phenomenology of pool boiling, spray/jet impingements, gas-assisted evaporation, and synthetic jet impingement with dielectrics liquids.
Book
Advances in Thermal Modeling of Electronic Components and Systems. Volume 1
TL;DR: In this article, the authors present a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.