Avram Bar-Cohen

TL;DR: In this article, the authors present a set of recommendations for the development of a new comprehensive flow pattern map that not only covers adiabatic, evaporating and condensing flows in one seamless flow pattern identification tool, but also includes multiscale information about the flow itself, and furthermore contains embedded mechanistic methods for the principal two-phase phenomena for use in developing unified models for pressure gradients, heat transfer, void fraction, CHF, etc., all in one coherent global method.

TL;DR: In this paper, the benefits of underfilling in direct chip attach (DCA) configurations were explored and the results indicated that to minimize fatigue failure, the CTE of an underfill material should match that of solder material and its Young's Modulus should be as high as the adhesion strength of the underfill allows.

TL;DR: In this article, the authors present a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.

TL;DR: In this article, the effects on the boiling curve of having air dissolved in the fluid are documented, showing that fluid in the vicinity of the heating element is apparently liberated of dissolved gas during boiling.

TL;DR: In this paper, the theoretical basis for the least material optimization of convectively cooled arrays of longitudinal, rectangular fin is presented, and the aspect ratio (fin thickness divided by fin width J of the array-optimum fin is found to be only marginally thinner than implied by the conventional single fin optimization.