Avram Bar-Cohen

TL;DR: In this paper, the authors derived analytic relations for natural convection heat transfer coefficients along isothermal or isoflux channel surfaces for thermal optimization of printed circuit cards and fin arrays.

TL;DR: The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram Bar-Cohen during 2012-2015 to target an order of magnitude improvement in chip level and hot spot heat fluxes, compared to the then state-of-the-art (SOA) as discussed by the authors.

TL;DR: In this article, it is argued that completion of the "inward migration" of thermal packaging technology, through the development and application of Gen-3 embedded cooling techniques, utilizing local on-chip microfluidic and thermoelectric heat extraction, can enable highly efficient computational platforms.

TL;DR: In this paper, the experimental results of Si/SiGe superlattice microcoolers are described, which are used to cool the target hot spot on a 65μm-thick silicon substrate.

TL;DR: In this article, a power module includes a power switching device, at least one spot cooler and a base cooler, which are configured to lower an average surface junction temperature and to isothermalize the surface junction.