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David J. Srolovitz

Researcher at City University of Hong Kong

Publications -  557
Citations -  30310

David J. Srolovitz is an academic researcher from City University of Hong Kong. The author has contributed to research in topics: Grain boundary & Dislocation. The author has an hindex of 87, co-authored 540 publications receiving 27162 citations. Previous affiliations of David J. Srolovitz include Los Alamos National Laboratory & University of Pennsylvania.

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Finite temperature structure and thermodynamics of the Au Σ5 (001) twist boundary

TL;DR: In this paper, the structure and thermodynamic properties of a Σ5 (001) twist boundary in gold are studied as a function of temperature, and the temperature dependences of the excess grain boundary free energy, enthalpy, entropy, specific heat, and excess volume are calculated.
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Friction between silicon and diamond at the nanoscale

TL;DR: In this article, the authors investigated the nanoscale friction between diamond-structure silicon (Si) and diamond via molecular dynamics simulation, where the interaction between the interfaces is considered as strong covalent bonds.
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A simulation of void linking during ductile microvoid fracture

TL;DR: In this article, a computer model has been developed in order to simulate the low temperature ductile fracture of metals which contain arrays of holes or voids, and the simulation models the step-wise character of the strain-induced hole linking process assuming an initial hole microstructure, localized plasticity near holes, and a strain-based criterion for failure of ligaments between holes.
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Grain boundary self-diffusion in Ni: Effect of boundary inclination

TL;DR: In this paper, the influence of the boundary plane on grain-boundary diffusion in Ni through a series of molecular dynamics simulations was examined, and it was shown that the activation energy for self-diffusion in a (103) symmetric tilt boundary is much higher than in boundaries with other inclinations.
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Do stresses modify wetting angles

TL;DR: In this paper, the authors present a transparent analysis of the effect of stress on the wetting angles that describe equilibrium three-phase junctions in solid-solid systems, and show that the impact of stress is independent of the elasticity of the system.