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David J. Srolovitz
Researcher at City University of Hong Kong
Publications - 557
Citations - 30310
David J. Srolovitz is an academic researcher from City University of Hong Kong. The author has contributed to research in topics: Grain boundary & Dislocation. The author has an hindex of 87, co-authored 540 publications receiving 27162 citations. Previous affiliations of David J. Srolovitz include Los Alamos National Laboratory & University of Pennsylvania.
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On the temperature dependence of grain boundary mobility
TL;DR: In this article, a mechanistic model for grain boundary migration is proposed, based on the formation and migration of line defects (disconnection) within the GB, and the results capture all of these observed temperature dependencies and are shown to be in quantitative agreement with each other and direct simulations of GB migration for a set of specific grain boundaries.
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Local atomic structure of amorphous metals
TL;DR: In this article, the local parameters are introduced to describe the local atomic structure of amorphous metals and define the structural defects which facilitate the explanation of various properties, including the volume change by annealing.
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Surface segregation in thin films
TL;DR: In this paper, the authors present a theoretical analysis of the effects of thickness on surface segregation in thin films, which predicts surface composition as a function of the heat of segregation, temperature and film thickness.
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A Combined Molecular Dynamics and Finite Element Analysis of Contact and Adhesion of a Rough Sphere and a Flat Surface
H. Eid,George G. Adams,Nicol E. McGruer,Andrea Fortini,Sergey V. Buldyrev,David J. Srolovitz +5 more
TL;DR: In this article, a combined molecular dynamics and finite element model and simulation of contact and adhesion between a rough sphere and a flat surface has been developed using the results of molecular dynamics simulations, obtained using an embedded atom potential, of a nanoscale Ru-Ru asperity contact.
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A micromechanical continuum model for the tensile behavior of shape memory metal nanowires
TL;DR: In this article, a micromechanical continuum model for the unique tensile behavior of single-crystalline face-centered-cubic metal (Cu, Ni, and Au) nanowires is presented.