D
David J. Srolovitz
Researcher at City University of Hong Kong
Publications - 557
Citations - 30310
David J. Srolovitz is an academic researcher from City University of Hong Kong. The author has contributed to research in topics: Grain boundary & Dislocation. The author has an hindex of 87, co-authored 540 publications receiving 27162 citations. Previous affiliations of David J. Srolovitz include Los Alamos National Laboratory & University of Pennsylvania.
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Microstructural stability of stressed lamellar and fiber composites
TL;DR: In this paper, a linear stability analysis was performed to examine the effect of stresses on the interface diffusion controlled morphological stability of lamellar and fibrous (rod-like phase) eutectic microstructures.
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Clock-model description of incommensurate ferroelectric films and of nematic-liquid-crystal films
TL;DR: In this paper, the transmission electron micrographs of submicrometer-thick specimens of incommensurate barium sodium niobate obtained by Xiao-qing et al. exhibit textures with lines of disclinations ending in vertices of Friedel index m=+1.
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Structure and energy of (111) low-angle twist boundaries in Al, Cu and Ni
TL;DR: In this paper, the structure and energy of low-angle twist boundaries in face-centered cubic Al, Cu and Ni, using a generalized Peierls-Nabarro model incorporating the full disregistry vector in the slip plane and the associated stacking fault energy.
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Edge dislocation-circular inclusion interactions at elevated temperatures
TL;DR: In this paper, a straight edge dislocation interacting with a cylindrical inclusion of infinite extent is considered and it is shown that along approximately 1 2 of the glide planes intersecting the inclusion, the dislocation is attracted toward the inclusion.
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Monte Carlo simulation of phase separation during thin‐film codeposition
TL;DR: In this paper, the results of Monte Carlo simulation of phase separation during binary film coevaporation are presented for a range of deposition conditions, assuming that phase separation occurs through surface interdiffusion during deposition, while the bulk of the film remains frozen.