Carrier concentration profiles of two-dimensional electron gases are investigated in wurtzite, Ga-face AlxGa1−xN/GaN/AlxGa1−xN and N-face GaN/AlxGa1−xN/GaN heterostructures used for the fabrication of field effect transistors. Analysis of the measured electron distributions in heterostructures with AlGaN barrier layers of different Al concentrations (0.15<x<0.5) and thickness between 20 and 65 nm demonstrate the important role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces. Characterization of the electrical properties of nominally undoped transistor structures reveals the presence of high sheet carrier concentrations, increasing from 6×1012 to 2×1013 cm−2 in the GaN channel with increasing Al-concentration from x=0.15 to 0.31. The observed high sheet carrier concentrations and strong confinement at specific interfaces of the N- and Ga-face pseudomorphic grown heterostructures can be explained as a consequence of interface charges induced by ...

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Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures

Phosphor-converted white light-emitting diodes (pc-WLEDs) are emerging as an indispensable solid-state light source for the next generation lighting industry and display systems due to their unique properties including but not limited to energy savings, environment-friendliness, small volume, and long persistence. Until now, major challenges in pc-WLEDs have been to achieve high luminous efficacy, high chromatic stability, brilliant color-rending properties, and price competitiveness against fluorescent lamps, which rely critically on the phosphor properties. A comprehensive understanding of the nature and limitations of phosphors and the factors dominating the general trends in pc-WLEDs is of fundamental importance for advancing technological applications. This report aims to provide the most recent advances in the synthesis and application of phosphors for pc-WLEDs with emphasis specifically on: (a) principles to tune the excitation and emission spectra of phosphors: prediction according to crystal field theory, and structural chemistry characteristics (e.g. covalence of chemical bonds, electronegativity, and polarization effects of element); (b) pc-WLEDs with phosphors excited by blue-LED chips: phosphor characteristics, structure, and activated ions (i.e. Ce 3+ and Eu 2+ ), including YAG:Ce, other garnets, non-garnets, sulfides, and (oxy)nitrides; (c) pc-WLEDs with phosphors excited by near ultraviolet LED chips: single-phased white-emitting phosphors (e.g. Eu 2+ –Mn 2+ activated phosphors), red-green-blue phosphors, energy transfer, and mechanisms involved; and (d) new clues for designing novel high-performance phosphors for pc-WLEDs based on available LED chips. Emphasis shall also be placed on the relationships among crystal structure, luminescence properties, and device performances. In addition, applications, challenges and future advances of pc-WLEDs will be discussed.

Phosphors in phosphor-converted white light-emitting diodes: Recent advances in materials, techniques and properties

Wide bandgap semiconductors are extremely attractive for the gamut of power electronics applications from power conditioning to microwave transmitters for communications and radar. Of the various materials and device technologies, the AlGaN/GaN high-electron mobility transistor seems the most promising. This paper attempts to present the status of the technology and the market with a view of highlighting both the progress and the remaining problems.

AlGaN/GaN HEMTs-an overview of device operation and applications

More than one-fifth of US electricity is used to power artificial lighting. Light-emitting diodes based on group III/nitride semiconductors are bringing about a revolution in energy-efficient lighting.

Prospects for LED lighting

The role of extended and point defects, and key impurities such as C, O, and H, on the electrical and optical properties of GaN is reviewed. Recent progress in the development of high reliability contacts, thermal processing, dry and wet etching techniques, implantation doping and isolation, and gate insulator technology is detailed. Finally, the performance of GaN-based electronic and photonic devices such as field effect transistors, UV detectors, laser diodes, and light-emitting diodes is covered, along with the influence of process-induced or grown-in defects and impurities on the device physics.

Gan : processing, defects, and devices

There are three possible ways of reducing the charge density (ns) in the N-polar high electron mobility transistors (HEMT) structures, by decreasing the channel thickness, applying reverse gate bias, or modifying the back-barrier. Understanding the behavior of 2DEG mobility as a function of ns is essential to design high performance HEMT devices. Experimental data show that in the N-polar HEMT structures, the 2DEG mobility reduces as the ns decreases by applying reverse gate bias or decreasing channel thickness, whereas in the Ga-polar HEMT structures, the 2DEG mobility increases as the ns in the channel decreases by applying reverse gate bias. In this paper, the 2DEG mobility as a function of ns is calculated in N-polar HEMTs for three different aforementioned cases, and is compared to that in the Ga-polar HEMT structures. It is shown that the conventional scattering mechanisms cannot explain these different behaviors. Two new scattering mechanisms, such as scattering from charged interface states and su...

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Model to explain the behavior of 2DEG mobility with respect to charge density in N-polar and Ga-polar AlGaN-GaN heterostructures

N-polar high electron mobility transistors (HEMTs) were fabricated from GaN/AlGaN/GaN heterostructures grown on n-type vicinal C-face SiC substrates by metalorganic chemical vapor deposition. The heterostructures had a sheet charge density and mobility of 6.6×1012 cm−2 and 1370 cm2 V−1 s−1, respectively. HEMTs with a gate length of 0.7 μm had a peak transconductance of 135 mS/mm, a peak drain current of 0.65 A/mm, and a three-terminal breakdown voltage greater than 150 V. At a drain bias of 20 V, the current-gain and power-gain cutoff frequencies with the pad capacitances de-embedded were 17 and 33 GHz, respectively.

Electrical properties of N-polar AlGaN/GaN high electron mobility transistors grown on SiC by metalorganic chemical vapor deposition

Growth and properties of InGaN nanoscale islands on GaN

Fabrication of relaxed InGaN pseudo-substrates composed of micron-sized pattern arrays with high fill factors using porous GaN

Ba Sr TiO (BST) thin films have large dielectric constants that can be varied by as much as a factor of 3 with an applied field, making them attractive for radio frequency (RF) cir- cuits as small-area ac bypass/dc blocking capacitors, or high-power varactors. However, BST must be deposited at relatively high tem- peratures in an oxidizing environment, presenting significant in- tegration challenges for MMIC applications. This letter describes the successful integration of BST films on AlGaN/GaN high elec- tron-mobility transistor (HEMT) monolithic microwave integrated circuits on sapphire substrates. A sacrificial SiO buffer layer is used to protect the underlying AlGaN during the RF magnetron sputtering of the BST film at an elevated temperature, with a care- fully controlled heater ramp rate to avoid degradation of the ohmic contacts on the HEMT.

Stacia Keller

Papers

Model to explain the behavior of 2DEG mobility with respect to charge density in N-polar and Ga-polar AlGaN-GaN heterostructures

Electrical properties of N-polar AlGaN/GaN high electron mobility transistors grown on SiC by metalorganic chemical vapor deposition

Growth and properties of InGaN nanoscale islands on GaN

Fabrication of relaxed InGaN pseudo-substrates composed of micron-sized pattern arrays with high fill factors using porous GaN

Integration of>tex /tex<Thin Films With AlGaN/GaN HEMT Circuits