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Proceedings ArticleDOI

Characterization of linewidth variation

TLDR
In this article, a three-step methodology is presented to identify the causes of line width variation with distinct spatial signatures by spatial analysis, and sources with similar spatial signatures are then separated by contributor-specific measurements.
Abstract
Characterization of line width variation by a three-step methodology is presented. Causes of line width variation with distinct spatial signatures are first isolated by spatial analysis. Sources with similar spatial signatures are then separated by contributor-specific measurements. Unanticipated components are lastly identified by examination of the residual from spatial analysis. Significant sources include photomask error, flare, aberrations, development non-uniformity, and scan direction asymmetry. These components are synthesized to quantify the contributions from the three modules of the patterning process: photomask, exposure system, and post-exposure processing. Although these modules are independent of one another their effects on line width variation may be correlated. Moreover, the relative contributions of the modules are found to vary with exposure tool, development track, and lithography strategy, affirming the usefulness of the methodology in process tracking and optimization.

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Citations
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Journal Article

Improving resolution in photolithography with a phase-shifting mask

TL;DR: The phase-shifting mask as mentioned in this paper consists of a normal transmission mask that has been coated with a transparent layer patterned to ensure that the optical phases of nearest apertures are opposite.
Proceedings ArticleDOI

Reducing DfM to practice: the lithography manufacturability assessor

TL;DR: In this paper, a methodology to quantify the lithography component of manufacturability is proposed and its feasibility demonstrated and three stages of lithography assessment are described: process window analysis on realistic integrated circuits following layout manipulations for resolution enhancement and the application of optical proximity correction, failure sensitivity analysis on simulated achievable dimensional bounds (a.k.a. variability bands), and yield risk analysis on iso-probability bands.
Patent

Optical proximity correction method for intermediate-pitch features using sub-resolution scattering bars

TL;DR: In this paper, the authors proposed a graph-based method of providing scattering bars for optical proximity effect correction on the mask used in the lithography process, a graph is provided.
Proceedings ArticleDOI

Aberration-aware robust mask design with level-set-based inverse lithography

TL;DR: In this article, the wave aberration function is incorporated into an inverse imaging framework for robust input mask pattern design against aberrations, and a level-set-based time-dependent model can then be applied to solve it with appropriate finite difference schemes.
Journal ArticleDOI

Linewidth variation characterization by spatial decomposition

TL;DR: In this paper, the contribution of photomask, exposure system, and post-exposure processing to linewidth variation has been investigated, and the most effective means to reducing the overall linwidth variation depends on the relative importance between these components.
References
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Journal Article

Improving resolution in photolithography with a phase-shifting mask

TL;DR: The phase-shifting mask as mentioned in this paper consists of a normal transmission mask that has been coated with a transparent layer patterned to ensure that the optical phases of nearest apertures are opposite.
Journal ArticleDOI

Impact of lens aberrations on optical lithography

TL;DR: The impact of different types of aberrations on lithographic imagery through simulation is examined and new techniques for measuring aberration by examining lithographically printed resist patterns are considered.
Journal Article

Imaging characteristics of multi-phase-shifting and halftone phase-shifting masks

TL;DR: In this paper, phase-shifting masks and imaging characteristics are discussed and compared with those of conventional transmission masks and a halftone phase shifting mask is suggested for printing isolated patterns and it gives wider focus latitude than conventional mask technology.
Proceedings ArticleDOI

Subhalf-micron lithography system with phase-shifting effect

TL;DR: In this article, a new imaging technology for the 64M DRAM, named "CQUEST" (Canon Ql/adrupole Effect for Stepper Technology), is derived from the mathematical analysis of the partial coherence theory.
Journal Article

New phase shifting mask with self-aligned phase shifters for a quarter micron photolithography

TL;DR: In this paper, a self-aligned phase shifter was proposed to reduce the width of photo-intensity to 60% of that without phase shifters, while keeping high contrasts.
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