scispace - formally typeset
Journal ArticleDOI

Comparative study on in situ surface cleaning effect of intrinsic oxide-covering GaAs surface using TMA precursor and Al2O3 buffer layer for HfGdO gate dielectrics

TLDR
In this article, a comparative study on the cleaning effect of the intrinsic oxide covering GaAs surface using TMA precursor and Al2O3 buffer layer was performed, and the combined results of X-ray photoemission spectroscopy (XPS) analysis and electrical evaluation indicates that the trimethylaluminum (TMA) precursor can effectively remove surface oxides on the GaAs substrate and inhibit oxygen diffusion in a manner similar to the Al 2 O 3 buffer layer, thus avoiding the generation of the low-k Al 2O3 interface layer.
Abstract
In this work, comparative study on the cleaning effect of the intrinsic oxide covering GaAs surface using TMA precursor and Al2O3 buffer layer were performed. GaAs substrates were either exposed to the TMA precursor or Al2O3 buffer layer was deposited on them under the same cycle prior to the deposition of HfGdO films. The combined results of X-ray photoemission spectroscopy (XPS) analysis and electrical evaluation indicates that the trimethylaluminum (TMA) precursor can effectively remove surface oxides on the GaAs substrate and inhibit oxygen diffusion in a manner similar to the Al2O3 buffer layer, thus avoiding the generation of the low-k Al2O3 interface layer. Moreover, the reduction in valence band offset and the increase in conduction band offset were obtained through passivated atomic-layer-deposition (ALD) of the TMA precursor. The MOS capacitor with GaAs passivated by 20 cycles TMA ALD showed almost no hysteresis, minimum interface state density (∼1.5 × 1012 cm−2 eV−1), greatest band offset (∼2.86 eV), and smaller oxide charge density (∼−2.76 × 1013 cm−2), which led to the maximum dielectric constant (∼35.9) and the lowest leakage current density (∼1.4 × 10−5 A cm−2). Furthermore, the leakage current density–voltage (J–V) characteristic curves at low temperature determined that the device showed stable and reliable electrical properties.

read more

Citations
More filters
Journal ArticleDOI

Degradation study of arsenic oxides under XPS measurements

TL;DR: In this paper, the authors explored the nature and extent of As2O5.5/3H2O phase degradation under X-ray measurements in order to assess the intrinsic impact of this spectroscopic technique on the collected data and found that degradation involves reduction of As(V) to As(III) species along with oxygen lost from the oxide lattice.
Journal ArticleDOI

Comparative passivation effect of ALD-driven HfO2 and Al2O3 buffer layers on the interface chemistry and electrical characteristics of Dy-based gate dielectrics

TL;DR: In this article, a comparative study of the effects of atomic layer-deposited (ALD) HfO2 and Al2O3 interfacial passivation layers (IPL) on the sputtering-derived HfDyOx (HDO)/Si gate stack has been systematically investigated.

Structure and characteristiscs of reactive magnetron sputtered (CrTaTiVZr)N coatings.

TL;DR: In this paper, the effects of substrate bias at 0-V to −200-V on the chemical composition, microstructure, as well as mechanical and electrical properties of the coatings were investigated.
Journal ArticleDOI

Analysis of the electrical properties and current transportation mechanism of a metal oxide semiconductor (MOS) capacitor based on HfGdO gate dielectrics

TL;DR: In this article, the microstructure, optical and electrical properties of sputtering-derived high-k gate dielectric thin films as a function of the Gd doping content have been systematically investigated.
Journal ArticleDOI

Ni doping significantly improves dielectric properties of La2O3 films

TL;DR: In this paper, Ni is first doped into Lanthanum oxide (La2O3) by reactive co-sputtering for a novel dielectric film, which shows that proper amount of Ni (∼10.04%) doping can effectively improve the performance of La 2O3, exhibiting desired microstructure, large band gap (5.7
References
More filters
Book

Semiconductor Material and Device Characterization

TL;DR: In this article, the authors present a characterization of the resistivity of a two-point-versus-four-point probe in terms of the number of contacts and the amount of contacts in the probe.
Journal ArticleDOI

Precise Determination of the Valence-Band Edge in X-Ray Photoemission Spectra: Application to Measurement of Semiconductor Interface Potentials

TL;DR: In this article, a method for locating the valence-band edge in x-ray photo-emission spectra is reported. But this method is not suitable for measuring semiconductor interface potentials.
Journal ArticleDOI

High-k organic, inorganic, and hybrid dielectrics for low-voltage organic field-effect transistors.

TL;DR: A comparison study of high-k Dielectric Materials for OFETs using self-Assembled Monoand Multilayers and Inorganic-Organic Bilayers to study the properties of polymeric-Nanoparticle Composites.
Journal ArticleDOI

Band offsets of high K gate oxides on III-V semiconductors

TL;DR: In this article, the band offsets of various gate dielectrics including HfO2, Al2O3, Gd2O 3, Si3N4, and SiO2 on III-V semiconductors such as GaAs, InAs, GaSb, and GaN have been calculated using the method of charge neutrality levels.
Journal ArticleDOI

GaAs interfacial self-cleaning by atomic layer deposition

TL;DR: In this paper, the reduction and removal of surface oxides from GaAs substrates by atomic layer deposition (ALD) of Al2O3 and HfO2 was studied using in situ monochromatic x-ray photoelectron spectroscopy.
Related Papers (5)