Journal ArticleDOI
Degradation of oxynitride gate dielectric reliability due to boron diffusion
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TLDR
In this article, the impact of the suppression of boron diffusion via nitridation of SiO2 on gate oxide integrity and device reliability was investigated using oxynitride gate dielectrics.Abstract:
In this letter, we report on the impact of the suppression of boron diffusion via nitridation of SiO2 on gate oxide integrity and device reliability SiO2 subjected to rapid thermal nitridation in pure nitric oxide (NO) is used to fabricate thin oxynitride gate dielectrics Both n+ polycrystalline silicon (polysilicon) gated n‐MOS (metal–oxide semiconductor) and p+‐polysilicon gated p‐MOS devices were subjected to anneals of different times to study the effect of dopant diffusion on gate oxide integrity As expected, an advanced oxynitride gate dielectric will effectively alleviate the boron‐penetration‐induced flatband voltage instability in p+‐polysilicon gated p‐MOS capacitors due to the superior diffusion barrier properties However, such improvements are observed in conjunction with some degradation of the oxide reliability due to the boron‐blocking/accumulation inside the gate dielectric Results show that even though the oxide quality is slightly degraded for NO‐nitrided SiO2 with p+‐polysilicon garead more
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Journal ArticleDOI
Scaling the gate dielectric: materials, integration, and reliability
TL;DR: A review of the more "fundamental" concerns regarding the scaling of the gate dielectric in the ultrathin regime is presented and a methodology is presented to calculate device and chip lifetimes for MOS structures on the basis of data extracted from voltage- and temperature-accelerated measurements.
Journal ArticleDOI
Growth and characterization of ultrathin nitrided silicon oxide films
TL;DR: It is shown that a basic understanding of the gas-phase and thin-film oxygen and nitrogen incorporation chemistries facilitates the processing of layered oxynitride nanostructures with desirable electrical properties.
Journal ArticleDOI
NH3-annealed atomic-layer-deposited silicon nitride as a high-k gate dielectric with high reliability
TL;DR: In this paper, a gate dielectric was formed at low temperatures (⩽550 °C) by an atomic-layerdeposition (ALD) technique with subsequent NH3 annealing at 550 ô°C.
Journal ArticleDOI
The composition of ultrathin silicon oxynitrides thermally grown in nitric oxide
TL;DR: In this article, high resolution medium energy ion scattering for ultrathin films was used to determine the nitrogen depth distribution and the composition of the NO-grown films, and it was observed that the nitrogen distribution is distributed relatively evenly in the film, unlike the sharply peaked distribution observed in the case of SiO2 films that were subsequently annealed in NO.
Journal ArticleDOI
Monolayer-level controlled incorporation of nitrogen in ultrathin gate dielectrics using remote plasma processing: Formation of stacked “N–O–N” gate dielectrics
Hiro Niimi,Gerald Lucovsky +1 more
TL;DR: In this paper, a low thermal budget approach to monolayer-level controlled incorporation of nitrogen in ultrathin gate dielectrics using 300°C, remote plasma processing is discussed.
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