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Proceedings ArticleDOI

Effect of gate engineering in FinFET for RF applications

TLDR
In this article, the authors presented the RF performance of gate-engineered FinFETs and analyzed the capability of single material gate (SMG), dual-material gate (DMG), and triple material gate gate (TMG) for RF performance characteristics.
Abstract
This paper presents the Radio Frequency Performance of gate engineered FinFET. Gate engineering is process of implementing different materials with different work functions on gate of device, and studying its impact on device operation. We have analyzed the capability of Single Material Gate (SMG), Dual Material Gate (DMG) and Triple Material Gate (TMG) gate FinFET for RF performance characteristics. We have used 3-D device simulation to extract the RF figure of merits such as transconductance generation factor (g m /I d ), cut-off frequency (f t ) and maximum oscillation frequency (f max ). The effect of different gate length ratios has also been reported. The result shows that TMG-FinFET exhibit superior RF performance as compared to SMG and DMG- FinFET.

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Citations
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Journal ArticleDOI

Influence of gate and channel engineering on multigate MOSFETs-A review

TL;DR: The effect of gate and channel engineering on the characteristics (both D.c. and a.c)) of multigate MOSFETs have been investigated and presented and recent developments in gate & channel engineering is included.
Journal ArticleDOI

Design and Optimization of Novel Shaped FinFET

TL;DR: In this article, a novel highperformance and miniaturized fin-shaped field effect transistor has been proposed which has been named as rectzoidal (rectz) because of its origin from the existing rectangular (rect) and trapezoidal (trap) structures.
Proceedings ArticleDOI

A review of nanoscaled bulk double gate and triple gate FETs for low standby power application

TL;DR: In this article, the electrical characteristics of bulk double gate (DG) and triple gate (TG) FETs for low standby power application are reviewed using various peer reviewed literature.
Proceedings ArticleDOI

Impact of Interface Trap Charge on Analog/RF parameters of Novel Heterogeneous Gate Dielectric Tri-Metal Gate FinFET

TL;DR: In this paper, an innovative structure is introduced to optimize TMG FinFET by employing dielectric material engineering, where HfO 2 is placed towards the source side, with SiO 2 towards the drain to enhance the I ON and simultaneously suppress I OFF for the proposed device.
References
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Journal ArticleDOI

Beyond the conventional transistor

TL;DR: In this paper, the authors focus on approaches to continue CMOS scaling by introducing new device structures and new materials, including high-dielectric-constant (high-k) gate dielectric, metal gate electrode, double-gate FET and strained-silicon FET.
Proceedings ArticleDOI

Extracting small-signal model parameters of silicon MOSFET transistors

TL;DR: In this article, an approach to the extraction of small signal model parameters for silicon MOSFETs is described, which is based on S-parameter measurements to obtain both the intrinsic and parasitic resistance model parameter values of the model.
Journal ArticleDOI

Influence of Channel and Gate Engineering on the Analog and RF Performance of DG MOSFETs

TL;DR: This paper investigates the influence of both channel and gate engineering on the analog and RF performances of double-gate (DG) MOSFETs for system-on-chip applications and shows improvements in gate- and channel-engineered devices.
Journal ArticleDOI

Effect of gate engineering in double-gate MOSFETs for analog/RF applications

TL;DR: It is demonstrated that TM-DG MOSFET can be a viable option to enhance the performance of SOI technology for high-frequency analog applications.
Journal ArticleDOI

Beyond the conventional transistor

TL;DR: In this article, the authors review recent progress in new technology features for silicon CMOS and suggest areas for further study in non-silicon-FET based device and system architectures.
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