Journal ArticleDOI
Enhancing Signal and Power Integrity Using Double Sided Silicon Interposer
TLDR
In this article, a double-sided silicon interposer for low impedance power delivery is presented for power ground planes in inhomogeneous dielectrics with conductive subsections using the multi-layered finite difference method (M-FDM).Abstract:
A novel double sided silicon interposer for low impedance power delivery is presented. In this letter, a model for power ground planes in inhomogeneous dielectrics with conductive subsections using the multi-layered finite difference method (M-FDM) is presented. Benefits of the silicon interposer in mitigating signal integrity issues arising due to return path discontinuities (RPDs) are also discussed for the first time along with a comparison to glass interposer.read more
Citations
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Journal ArticleDOI
Heterogeneous 2.5D integration on through silicon interposer
Xiaowu Zhang,Jong Kai Lin,Sunil Wickramanayaka,Songbai Zhang,Roshan Weerasekera,Rahul Dutta,Ka Fai Chang,King Jien Chui,Hongyu Li,David Ho,Liang Ding,Guruprasad Katti,Suryanarayana Shivakumar Bhattacharya,Dim-Lee Kwong +13 more
TL;DR: 2.5D Through-Si-Interposer (TSI) is a strong candidate to deliver improved performance while consuming lower power than in previous generations of servers/data centers and mobile devices.
Journal ArticleDOI
Interposer Technologies for High-Performance Applications
Ahmad Usman,Etizaz Hassan Shah,Nithanth B. Satishprasad,Jialou Chen,Steven A. Bohlemann,Sajjad Haider Shami,Ali A. Eftekhar,Ali Adibi +7 more
TL;DR: The future trends, promising advancements, and market requirements with special emphasis on glass interposer technologies as evaluated to be the most viable option for the future high-performance applications are discussed.
Journal ArticleDOI
Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages
TL;DR: In this paper, the authors proposed and evaluated three important resonance suppression techniques based on the 3-D interposer die configuration, the selection and placement of decoupling capacitors, and the 3D interposition package power and ground stack-up.
Journal ArticleDOI
Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I
Etienne Sicard,Wu Jian-fei,Rongjun Shen,Er-Ping Li,En-Xiao Liu,Joungho Kim,Jonghyun Cho,Madhavan Swaminathan +7 more
TL;DR: The technology roadmap towards 3D-ICs is illustrated and the associated EMC challenges are described, and the role of interposers, associated electrical parasitics, and concerns about signal and power integrity are addressed.
References
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Book
Power Integrity Modeling and Design for Semiconductors and Systems
Madhavan Swaminathan,A.E. Engin +1 more
TL;DR: This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.
Journal ArticleDOI
A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
TL;DR: In this paper, a novel technique for suppressing power plane resonance at microwave and radio frequencies is presented, which consists of replacing one of the plates of a parallel power plane pair with a high impedance surface or electromagnetic band gap structure.
Journal ArticleDOI
Designing and Modeling for Power Integrity
Madhavan Swaminathan,Daehyun Chung,Stefano Grivet-Talocia,Krishna Bharath,Vishal Laddha,Jianyong Xie +5 more
TL;DR: In this paper, a specific case of RPD based on via discontinuities is discussed in detail in the context of both the frequency and time-domain waveforms using a test vehicle.
Journal ArticleDOI
Lossy power distribution networks with thin dielectric layers and/or thin conductive layers
TL;DR: In this paper, a lossy transmission-line grid model is used to simulate power-ground plane pairs with thin dielectric and thin conductive layers, which can provide good suppression of plane resonances in printed-circuit-board power distribution networks.
Journal ArticleDOI
Analysis and circuit model of a multilayer semiconductor slow-wave microstrip line
TL;DR: An analytical single-layer reduction quasi-static formulation to accurately compute all the line parameters of metal insulator semiconductor (MIS) and Schottky contact multilayer slow-wave microstrip lines is presented in this paper.
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