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Journal ArticleDOI

GaN and Related Materials for Device Applications

Stephen J. Pearton, +1 more
- 01 Feb 1997 - 
- Vol. 22, Iss: 2, pp 17-21
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TLDR
The addition of GaN, A1N, InN, and related alloys to the family of device-quality semiconductors has opened up new opportunities in short-wavelength (visible and ultraviolet [uv]) photonic devices for display and data-storage applications, solar-blind uv detectors, and high-temperature/high power electronics.
Citations
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Electron transport in wurtzite indium nitride

TL;DR: In this paper, the velocity field characteristics of wurtzite indium nitride were determined using an ensemble Monte Carlo approach, and it was found that indium oxide exhibits an extremely high peak drift velocity at room temperature, 4.3×107 cm/s, at a doping concentration of 1.0×1017 cm−3.
Journal ArticleDOI

Evaluation of the temperature stability of AlGaN/GaN heterostructure FETs

TL;DR: In this article, it was found that the temperature limit is given by the irreversible degradation of the intrinsic active heterostructure material itself during operation above 600/spl deg/C.
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Inversion domains in AlN grown on (0001) sapphire

TL;DR: In this paper, columnar inversion domains formed during AlN layer growth on (0001) sapphire were identified using transmission electron microscopy (TEM) and they were shown to have a V-like shape with boundaries that deviate by 2 {+-} 0.5° from the c-axis.
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Functional and smart materials

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Journal ArticleDOI

How Third-Body Processes Affect Friction and Wear

Irwin L. Singer
- 01 Jun 1998 - 
TL;DR: A review of the role of third-body processes and their role in controlling friction and wear of practical surface treatments can be found in this article, where it is shown that a low shear strength film can reduce the friction coefficient between two higher shear-strength materials in sliding contact.
References
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Journal ArticleDOI

Candela‐class high‐brightness InGaN/AlGaN double‐heterostructure blue‐light‐emitting diodes

Abstract: Candela‐class high‐brightness InGaN/AlGaN double‐heterostructure (DH) blue‐light‐emitting diodes(LEDs) with the luminous intensity over 1 cd were fabricated As an active layer, a Zn‐doped InGaN layer was used for the DH LEDs The typical output power was 1500 μW and the external quantum efficiency was as high as 27% at a forward current of 20 mA at room temperature The peak wavelength and the full width at half‐maximum of the electroluminescence were 450 and 70 nm, respectively This value of luminous intensity was the highest ever reported for blue LEDs
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Large‐band‐gap SiC, III‐V nitride, and II‐VI ZnSe‐based semiconductor device technologies

TL;DR: In this article, the authors compare the performance of SiC, GaN, and ZnSe for high-temperature electronics and short-wavelength optical applications and conclude that SiC is the leading contender for high temperature and high power applications if ohmic contacts and interface state densities can be further improved.
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P-Type Conduction in Mg-Doped GaN Treated with Low-Energy Electron Beam Irradiation (LEEBI)

TL;DR: In this article, the p-n junction LED using Mg-doped GaN treated with low-energy electron-beam irradiation (LEEBI) was reported for the first time.
Journal ArticleDOI

High-brightness InGaN blue, green and yellow light-emitting diodes with quantum well structures

TL;DR: In this paper, high-brightness blue, green and yellow light-emitting diodes (LEDs) with quantum well structures based on III-V nitrides were grown by metalorganic chemical vapor deposition on sapphire substrates.
Journal ArticleDOI

Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review

TL;DR: In this article, the status of SiC in terms of bulk crystal growth, unit device fabrication processes, device performance, circuits and sensors is discussed, focusing on demonstrated high-temperature applications, such as power transistors and rectifiers, turbine engine combustion monitoring, temperature sensors, analog and digital circuitry, flame detectors, and accelerometers.
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