Journal ArticleDOI
Nickel-palladium bond pads for copper wire bonding
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TLDR
These NiPd(Au) bond are shown to outperform Al in virtually all respects: bond strength, bond parameter window, lack of pad damage and reliability.About:
This article is published in Microelectronics Reliability.The article was published on 2011-01-01. It has received 67 citations till now. The article focuses on the topics: Wire bonding & Bond strength.read more
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Copper Wire Bonding
TL;DR: The advantages of Cu over Au, such as lower cost, higher mechanical strength, and higher electrical and thermal conductivity, are discussed in this article, and the adoption of Cu wire bonding in the semiconductor industry, as well as future projections for its usage are discussed.
Journal ArticleDOI
Copper Wire Bonding Concerns and Best Practices
TL;DR: In this article, the challenges associated with copper wire bonding and the solutions that the industry has been implementing are discussed and information to enable customers to conduct qualification and reliability tests on microelectronic packages to facilitate adoption in their target applications.
Journal ArticleDOI
Wire bonding using copper wire
TL;DR: A review of wire bonding using copper wire can be found in this paper, where the solutions to the problems and recent findings/developments in wire bonding with copper wire are discussed, and a brief review is conducted.
Proceedings ArticleDOI
Cu wire and beyond - Ag wire an alternative to Cu?
TL;DR: In this paper, the authors investigated the impact of Ag as a bonding wire and compared the responses with Au and Cu wires on a chip with active area and showed that Ag and Au showed less impact on the bond pad than Cu.
References
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Smithells metals reference book
TL;DR: In this paper, the authors present an X-ray analysis of metallic materials and their properties, such as elastic properties, damping capacity and shape memory alloys, as well as their properties of metal and alloys.
Journal ArticleDOI
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
TL;DR: No intermetallics formation or other microstructural change have been found on these interfaces up to 120 days at 150 °C, which was related to the full solubility of the materials along these interfaces, suggesting that they can be a successful industrial solution for the next generation of packages.
Journal ArticleDOI
Wire bonding using copper wire
TL;DR: A review of wire bonding using copper wire can be found in this paper, where the solutions to the problems and recent findings/developments in wire bonding with copper wire are discussed, and a brief review is conducted.