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Practical surface analysis: By auger and x-ray photoelectron spectroscopy
David Briggs,M. P. Seah +1 more
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The article was published on 1983-01-01 and is currently open access. It has received 4689 citations till now. The article focuses on the topics: Auger electron spectroscopy & X-ray photoelectron spectroscopy.read more
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XPS studies of active elements surface of gas sensors based on WO3−x nanoparticles
TL;DR: In this article, the structure of core levels W4f and O1s was explored by XPS-method Exposure of oxides to air at 293 K leads to the formation of WO3·(OH2)n-phase on the surface of nanoparticles.
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Electron spectroscopic analysis of the SiO2/Si system and correlation with metal–oxide–semiconductor device characteristics
Seiichi Iwata,Akitoshi Ishizaka +1 more
TL;DR: In this article, the ESCA measurement results on thin SiO2/Si samples are examined comprehensively, critically, and in detail to show that it is possible to correlate these results with MOS (metaloxide-semiconductor) device characteristics such as flatband (threshold) voltage, oxide breakdown field, mobile ion density, hole and electron trap density, and hot-carrier lifetime.
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Raman spectroscopy for the study of reduction mechanisms and optimization of conductivity in graphene oxide thin films
Xavier Díez-Betriu,S. Álvarez-García,Cristina Botas,Patricia Álvarez,Jorge Sánchez-Marcos,Carlos Prieto,Rosa Menéndez,Alicia de Andrés +7 more
TL;DR: In this article, the effects of low temperature annealing and chemical reduction on the properties of the films and present an optimized reduction process that allows the original 2D/G Raman intensity ratio of few-layer graphene to be recovered.
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Effect of synthesis parameters on catalytic properties of CuO-CeO2
TL;DR: A modified citrate method incorporating hydrothermal treatment of the precursors has been employed for the synthesis of CuO-CeO2 catalysts with varying CuO content.
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Silicon surface passivation by hydrogen termination: A comparative study of preparation methods
TL;DR: In this article, the authors compared the residue and chemical passivation after hydrogen termination by various low-temperature, wet-chemical techniques, cleaving in ultrahigh vacuum (UHV), and ion sputtering.