Journal ArticleDOI
Real-time stress evolution during early growth stages of sputter-deposited metal films: Influence of adatom mobility
TLDR
In this paper, the real-time stress evolution during the early growth stages of a large class of sputter-deposited metal (Me) films with monolayer sensitivity was studied using a multi-beam optical stress sensor.About:
This article is published in Vacuum.The article was published on 2014-02-01. It has received 51 citations till now. The article focuses on the topics: Surface stress & Stress (mechanics).read more
Citations
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In situ stress observation in oxide films and how tensile stress influences oxygen ion conduction.
Aline Fluri,Daniele Pergolesi,Vladimir Roddatis,Alexander Wokaun,Thomas Lippert,Thomas Lippert +5 more
TL;DR: An in situ simultaneous diagnostic of growth mode and stress during pulsed laser deposition of oxide thin films for strain engineering in Materials Science to fabricate novel devices with intriguing functionalities is described.
Journal ArticleDOI
On the origin of the metastable β-Ta phase stabilization in tantalum sputtered thin films
TL;DR: In this article, the authors combine in situ and real-time multiple beam optical stress sensor (MOSS) during sputter-deposition of Ta films together with ex situ X-ray diffraction (XRD) and high resolution transmission electron microscopy (HRTEM) to gain insights into the early growth stages and interface properties.
Journal ArticleDOI
A kinetic model for stress generation in thin films grown from energetic vapor fluxes
TL;DR: In this paper, a kinetic model for residual stress generation in thin polycrystalline thin films grown from energetic vapor fluxes, encountered, e.g., during sputter deposition, was developed.
Journal ArticleDOI
Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films
F. Cemin,Gregory Abadias,Tiberiu Minea,Clarisse Furgeaud,François Brisset,Denis Solas,Daniel Lundin +6 more
TL;DR: In this paper, the development of intrinsic stress and microstructure of copper (Cu) films deposited under energetic ion bombardment was investigated by in situ measurements in a high power impulse magnetron sputtering (HiPIMS) process for different substrate bias voltages.
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Volmer-Weber growth stages of polycrystalline metal films probed by in situ and real-time optical diagnostics
TL;DR: In this paper, the tensile force maximum has been attributed to the end of the islands coalescence stage, based on ex situ morphological observations, however, microstructural rearrangements are likely to occur in such films during post-deposition.
References
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Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TL;DR: A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.
Journal ArticleDOI
Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films
William D. Nix,Bruce M. Clemens +1 more
TL;DR: In this paper, the authors examined the stress associated with crystallite coalescence during the initial stages of growth in thin polycrystalline films with island growth morphology and predicted large tensile stresses in agreement with experimental results.
Journal ArticleDOI
Stresses in thin films: The relevance of grain boundaries and impurities
Journal ArticleDOI
Origin of compressive residual stress in polycrystalline thin films.
TL;DR: A model for compressive stress generation during thin film growth is presented in which the driving force is an increase in the surface chemical potential caused by the deposition of atoms from the vapor.
Journal ArticleDOI
Physical Origins of Intrinsic Stresses in Volmer–Weber Thin Films
TL;DR: In this paper, the fundamental mechanisms that can generate stresses during the growth of Volmer-Weber thin films are reviewed, including surface-stress effects and flux-driven incorporation of excess atoms within grain boundaries.
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Model for stress generated upon contact of neighboring islands on the surface of a substrate
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